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Lattice
Semiconductor's ispMACH 4000 CPLD shipment counter crosses
200 million
Advanced
Semiconductor reports 48.8% m-o-m sequential growth of revenues
in Feb 2010
The impact
of earthquake on TSMC's fabs
Schneider
Electric acquires Zicom's business to grow inorganically in
Indian market
88% rise
in semiconductor fab spending forecasted
Sony gets
9 international design awards for its sleek e-gadgets
Semiconductor
manufacturing equipment suppliers won 2009's Intel's supplier
awards
Silentium
selects ADI's Blackfin processors in their active noise control
products
Ramtron
granted with US patent for it's Ferroelectric RAM
NXP Semiconductor's
ICODE shipment crosses 1 billion
Ralink's
802.11n plus Bluetooth chip passes Bluetooth 3.0 + HS Qualification
GPS based
trial road test by NXP Semiconductor and IBM declared successful
Phototransistor-based
ambient light sensors video demo by Vishay
ADI is
offering Blackfin development tools at 73% less price for
one month
STM32
MCUs from ST Microelectronics can now access flash memory
with zero wait
Micronas
and ihr GmbH are in for a silicon and software co-operation
on LIN interface
Tabula
delivers breakthrough tech in FPGAs by adding another programming
variable
It's the
beginning of boom time for 3g and 4g semiconductor chip vendors
Mitsubishi
Electric to ramp up PV solar cell production
RF Micro
Devices is in for more defence collaboration and orders
RF Micro
Devices producing its RF720x WCDMA/HSPA+ power amplifiers
in volumes
Altair
Semiconductor and Aeroflex are collaborating on LTE testing
solutions
Digi-Key
to stock and sell Altera's FPGAs in Asia-Pacific region
MIT develops
wirelessly controlled Micro-helicopters displaying 3D images
in air
Electric
energy from human-body heat-difference with air: MIT innovation
Budget
2010-11 enables competitiveness of India's electronics hardware
manufacturing
SEMI publishes
new standards related to semiconductor manufacturing equipment
NXP Semiconductors
revenues grew by 8% in 4th quarter of 2009
Fujitsu
and Inova Semiconductor partners to develop graphic display
in automotives
64 GB
SDXC card from SanDisk for HD video recording apps
IBM and
Ricoh combinely develops advanced print monitoring and management
system
55 nm
Embedded Flash process tech from ST Micro for making automotive
MCU chips
ABOV Semiconductor
buys Teradyne's MCU test-gear
Gartner
estimates global semiconductor revenue to grow by 20% in 2010
Best consultants
related to India's electronics and semiconductor industry
ISRO successfully
tests solid rocket booster S200 for GSLV Mk III launch vehicle
India
Semiconductor Association suggests extending India semiconductor
policy to 2015
Fujitsu's
vein pattern scanning tech is adopted at a hospital in U.S.
to identify patients
TriQuint
Semiconductor's annual revenue up by 14% and quarterly by
12%
Second
generation data deduplication tech from Exar
Microchip
decides to pay more to acquire Silicon Storage Tech
Production
shipment of 40-nm Arria II GX FPGAs from Altera
Rescue
Alert selects IAR Embedded Workbench for its medical alarm
systems
Dialog
Semiconductor and TSMC partners on bipolar-CMOS-DMOS tech
Lineage
Power licenses DPT patents from Power-One
Dongbu
HiTek adopted Mentor's analog circuit simulator
Fujitsu
selling its RF/wireless modules in North American OEM market
Intel
infuses $3.5 billion to stimulate the growth of American tech
industry
Samsung
begins volume production of 4Gb DDR3 DRAM chips at 40nm node
Intel
and Nokia merge their mobile software platforms to counter
emerging challenges
Between
Xilinx and Altera at 28nm, who is the winner?
NXP Semiconductor
licenses ARM Cortex - M4 to enable its MCUs to handle multimedia
North
American semiconductor equipment Book-to-Bill Ratio is up
by 24.1%
SWOT
analysis of India's electronics and semiconductor industry
TSMC along
with MAPPER achieve new mile-stone in mask-free e-beam etching
of wafers
Cavium
showcases its chips and software for 3G and WiMAX networks
at MWC
Wipro
along with CAE to provide training support services to India's
Defence forces
TI's OMAP
gets Android development support from Wipro
Aeroflex
supplies TD-LTE test-gear to China Academy of Telecommunications
Research
Samsung
adopts ARM Mali graphics processor tech to drive its graphics
enabled SoCs
TranSwitch
and VoiceAge partners to accelerate the adoption of high definition
voice
Nokia
Siemens Networks expand its R&D center in Bangalore, India
Cypress
Semiconductor improves the accuracy of its touch interface
for 1 mm accurate stylus tip
BHEL and
Toshiba to form JV in electrical transmission and distribution
business
ANT+ and
TI working together in connecting low power sensors to smartphones
Two-pin
IEEE 1149.7 adopted by TI to test and debug SoCs
Trusted
Logic enhances features of its NFC tech integration on Google
Android
Campus
wide access of MATLAB in 60 plus institutes
Continuous
Computing, picoChip and Cavium partnering on LTE femtocell
reference design
Multiple
design contests in semiconductor and embedded systems design
for Indian EEs
Samsung
selects Broadcom's 'Combo' Chip to drive its new mobile handsets
ST-Ericsson
building support for Adobe Flash Player10.1 on its smart-phone
chips
Imec,
Renesas and M4S presents 40nm CMOS single-chip multi-standard
wireless transceiver
Fujitsu
and University of Toronto developed reliable read-method for
MRAM
Aeroflex
won 4G Wireless Evolution Product of the Year Award 2009
Ixia
and Rohde & Schwarz partners to achieve advancements in
LTE network quality assurance
Novellus,
IBM and CNSE partnering to develop 22nm semiconductor process
tech
ST's Corporate
VP: India deserves to have its own electronics-manufacturing
base
New Itanium
processor code named Tukwila is quad-core with 8 threads/core
Trident
Micro revenue in 4Q09 is nearly same as previous quarter
NEC
upgrades EMMA for portable media gadgets to handle 3D
2 Gb DDR3
DRAM chip jointly developed by Micron and Nanya
Synopsys
to gain electronic system virtualization expertise by acquiring
Coware
Smatphones
adopt Trusted Foundations in big way
APAC
IC adopts Synopsys' Galaxy
Septentrio
selects DDC-I's safety-critical Deos RTOS for its new innovations
Germany's
Pepper One opens certification centre for Z-Wave devices
Somfy
selects Melexis' single chip RFID transceiver IC to drive
its security apps
Exar adds
field programmable power regulator IC to its PowerXR portfolio
Energy
Micro selects IAR's Embedded Workbench to drive its ARM based
development kit
XLamp
LED from Cree to displace conventional light sources
Broadcom
to acquire Teknovus to expand its triple play with EPON tech
Agilent
partners with CMC Microsystems to provide EDA tools to Canadian
academia
Synopsys
acquires VaST Systems to widen its offerings for automotive/consumer
apps
CUI launches
updated website for AMT Encoder series
Bluetooth
v3.0 + High Speed wireless functionality to enhance Broadcom's
chips
Enea signs
partner agreement with Freescale
Karnataka
semiconductor policy recognizes 3 idiots
Intel
and Micron's 25-nanometer NAND flash tech for consumer electronic
gadgets
Galderma
R&D adopts Agilent's Electronic Lab Notebook to automate
scientific data management
New innovations
to improve density and I/O performance of Altera's 28-nm FPGAs
Aeroflex's
deploys Synopsys' unified circuit simulation for its ICs development
/ verification
Novatel
selects Anadigics power amplifiers to drive its wireless broadband
USB modems
Novellus
reaches 1000th VECTOR plasma-enhanced chemical vapor deposition
system shipment
ASTRI
uses R & S advanced test solution to verify its TD-LTE
Femto base stations
Karnataka
semiconductor policy to change the face of electronics industry
India
badly needs a semiconductor fab
Bel Fuse
acquires Cinch Connectors for $39 Million
More than
700,000 edge QAMs shipment by BigBand Networks
NXP's
design kit for RF small signal products within Agilent's Advanced
Design System
Electric
vehicles to drive automotive semiconductor market
TSMC holds
more than 50% share of top ten semiconductor foundries
Apple's
iPad is just a drizzle; heavy rain of tablet PCs highly predictable
in 2010 and 2011
Socle's
System-on-Chips are designed with Cosmic Circuits' Analog
IP cores
DIRECTV
adopts NXP Semiconductor's HD digital video recorder SoC solution
Ixia and
Agilent partner to provide HDMI 1.4 protocol test solution
Power-One
partners with Ericsson on digital power tech patent license
Motorola
home and network mobility solutions for Far EasTone WiMAX
4G service
New solutions
partner program from Echelon to promote energy efficiency
solutions
ISA Vision
summit 2010 to focus on "electronics designed and made
in India"
Microsemi
and MagnaChip Semiconductor partner on 350nm 72V mixed-signal
process tech
Microchip
partners with Texas A & M University
LSI and
Seagate collaborate on solid-state storage tech
Altair
and ANADIGICS partnered to drive LTE technology development
Xirgo
selects Atmel's Cortex-M3 Flash MCU for its asset tracking
platforms
Toshiba
uses Synopsys' low power verification methodology to verify
its chip designs
NEC Electronics
adopts Cadence EDI system for 40-nm ASIC designs
Five Indian
universities/colleges adopt Synopsys' VLSI design curriculum
DIRECTV
selects Entropic's Silicon to deliver HD digital and data
throughout the home
National
Semi India; small and smart team of analog and power semiconductor
experts
Agilent's
proposed acquisition of Varian cleared by European Commission
Creative
selects Ambarella's SoC solution to power its Vado HD pocket
video cam
Viking
Modular selects SandForce processor for its solid-state drive
devices
RTOS
from DDC-I now supports AMCC PowerPC 440 processor core
LG selects
Dialog Semiconductor's power management IC for Android Smartphone
CERN Large
Hadron Collider (LHC) now uses Kyocera's ceramic vacuum chamber
Evatronix
IP Cores now in LFoundry process design kit
Echelon
and ELO partnered to develop and market NES based smart energy
meters
AirMagnet
Enterprise 8.5 won Common Criteria Certification
New 3G/4G
mobile hotspot from Sierra powered by Beceem's 4G WiMAX solution
OTP memory
IP from Sidense drives Audium's power amplifier chip
Full production
shipment of GigOptix's 45G differential limiting amplifier
Samsung
and Rambus settle their patent related disputes and claims
Sigma
and Ralink partnering on 802.11n Wi-Fi ref. design for consumer
electronic apps
Full qualification
of Xilinx Virtex-6 FPGA family on UMC's 40nm process devices
NXP
Semiconductor goes another step ahead in securing its ID chips
Actel
FPGAs inside Boeing's 787 Dreamliner
Merry
times for Hynix semiconductor with its 4th quarter 2009 revenues
rose and profit-growth rocket
C-DAC
transfer wireless technologies to E2E for railways signaling
and communication
Future
Electronics to sell and stock Ramtron chips
Intel's
4th quarter 2009 revenues suggest single digit fall in global
semiconductor revenue
Micronas
and Lean partnered to provide customer-specific product distribution
services
ST Micro
joins CEA-Leti IMAGINE program to develop multiple e-beam
lithography
Agilent's
EEsof EDA channel on YouTube
LED
driver ICs from austriamicrosystem now powers LG's new LED
backlit TV
Microchip
gains WiFi capabilities by acquiring ZeroG Wireless
Microsemi
received first orders for its SecureWave millimeterwave security
products
ST Micro
unveils details of new family of three-axis digital accelerometers
ACCO Semiconductor
selects Agilent's RFIC solutions to design its CMOS power
amplifier
SPEL;
India's only semiconductor assembly and test services company
grows by 14%
Storage
and networking semiconductor specialist LSI increased its
India's R&D strength
STATS
ChipPAC wins Intersil's Supplier Award for its chip packaging
services
Origin
and Micron form JV company for developing solar cell technology
Atmel
opens a new R&D center in Taipei, Taiwan
Chitkara
Univ. collaborate with Seer Akademi in offering M.Tech in
VLSI
Broadcom's
STB and DTV SOCs supports RVU Alliance remote user interface
tech
ViXS partnered
with MIPS to enable high performance processors for multimedia
apps
One-Millionth
IC shipment from Gigoptix for multichannel parallel optical
interconnects
Asoka,
Gigafast using CopperGate's CG2110 chipset into their HomePlug
audio/video
LSI
achieves 25% overall leakage reduction by implementing TSMC's
PowerTrim tech
LED driver
ICs from Austriamicrosystems now powers LG Electronics LED
backlit TVs
Ultrafast
high voltage rectifiers from Microsemi are DSCC qualified
D2Audio
WIDESound x 4 enhancement tech from Intersil
Over 20
Million Instaport-enabled port processors shipment from Silicon
Image
LeCroy
demo Symwave's SuperSpeed USB 3.0-to-SATA storage device at
CES
Broadcom's
new SoC for digital terrestrial converter for Japan's Digital
TV
Ford cars
employ Broadcom's BCM4325 chip for wireless connectivity
Panasonic
Tech is part of the IEEE P1901 Draft 2.0 Broadband-Over-Powerline
comm
VLSID
2010 enlightens chip designers on <32nm challenges and
the emerging markets
Fujitsu's
USB 3.0-SATA Bridge IC wins USB-IF compliance certification
for SuperSpeed USB
Qualcomm
and HP showcases Android-based smartbook device
Murata
has commercialized 0603 size chip ferrite beads
Powerchip
Semiconductor December 2009 revenues up by 3%
Wipro
adds Android capabilities into its design service offerings
e2v's
CCD image sensors cross 10 years of continuous performance
on board a satellite
Netbook
growth to trigger additional growth in external monitors;
Isuppli
Cavium
to demonstrate wireless HD video at 2010 International CES
R&D
center at Rexchip by Elpida to develop 40nm 4F2 process tech
Sharp
ST and Enel are partnering to produce 30%+ efficient solar
PV panels in Italy
New product
inventions from Avalue won eighteenth Taiwan Excellence Award
Ready
reference design from Freescale Semiconductor for tablet smarbooks
Xilinx
to showcase its India team's design strength at VLSI Conference,
Bangalore
MEMC
Electronic Materials acquire ownership stake in Eversol
GE and
Metso collaborates to resell Metso Device Asset Management
Solution
Tejas
Networks won Deloitte Tech Fast 500 Asia award fourth time
in a row
Ravi Swaminathan
appointed as MD and VP of Sales and Marketing for AMD India
Walden
C. Rhines to present keynote at the International VLSI Conference
in Bangalore
Mentor
received the IPv6 interoperability approval for its Nucleus
V.6 networking stack
Broadcom
reaches settlement in stock options class action lawsuit
SunEdison
and Xcel Energy wins a deal for five photovoltaic solar installations
in New Mexico
QSound
Labs join in the ARM Solution Center for Android
Avaya
completes the acquisition of Nortel Enterprise Solutions
Kyivstar
GSM selects Alcatel-Lucent to power all-IP network transformation
in Ukraine
Eurotech
wins 1.2M USD contract to supply embedded computers
Redbridge
deploy BridgeWave's gigabit multiple wireless links in its
video surveillance system
Infineon
and Fairchild Semiconductor settle patent dispute on power
transistors
PICMG
announced new specifications for CompactPCI and AdvancedMC
Year 2009
is not that bad for memory chip makers and 2010 going to be
even better
40nm 2-Gigabit
DDR3 SDRAM volume production shipment from Elpida
65nm XS
Version 1-Gigabit DDR3 SDRAM from Elpida
Biometric
security solution replaces passwords with the scan of an employee's
palm
Atmel
integrate Immersion's TouchSense touch feedback tech into
its touch devices
PICMG
adopts PICMG 2.30 for cPCI and AMC.4 specification for AdvancedMC
WD and
NEC partnered to raise USB 3.0 standard with new storage interface
tech
Fairchild
Semiconductor's LED driver drives OSRAM's LED products
Rambus
acquire GLT's patents on lighting and optoelectronics tech
Atmel
collaborates with H&D to deliver power efficient embedded
Wi-Fi solution
Not
to miss event on semiconductors; VLSI conf. on Jan 3-7 2010
in Bangalore
High power
three-phase bridge rectifier modules from Microsemi are DSCC
qualified
Sony and
RealD collaborated to offer immersive 3D home entertainment
ST
Micro engages solidly with Indian power semiconductor market
QNX Neutrino
RTOS supports Cavium's OCTEON Plus multi-core processors
Dell'Oro
Group reports high-speed server network soars in the third
quarter 09
Marvell's
ARMADA 1000 SoC won "Best Media Processor System-on-Chip"
Award
EMU In-Home
Display from Rainforest earns ZigBee Smart Energy product
certification
Over 500
million SmartMX security chip shipment from NXP semiconductor
ITM selects
Broadcom's Bluetooth tech for its hands-free car kits
Upgraded
tech from broadcom to enhance bluetooth and Wi-Fi co-existence
in notebooks
UMC presented
new hybrid high-k/metal gate tech for 28nm at 2009 IEDM
Dell'Oro
reports 10% of decline in China mobile infrastructure market
in third quarter 09
Dr. Tinku
Acharya is elevated to IEEE Fellow for his contribution to
image processing
MATLAB;
an essential tool for a serious engineer
Interaction
with Xilinx-India CTO on FPGA design issues and trends
XtremeData
deploy Altera's Stratix IV FPGAs into its dbX Analytics appliances
Digi-Key
to distribute Torex' power ICs
LSI and
Wichita State University launch Center for Storage Networking
Research
Alcatel-Lucent
increased its IP router market share by four percent
Premier
institutes MIT, Carnegie and Purdue joins cybersecurity research
consortium
Battery
less TV remote control from NEC and Soundpower
AMD and
SiSoftware collaborates to develop OpenCL GPGPU benchmark
suite
Elpida
receives "2009 Global Warming Prevention Activity Award"
Sogitec
certified AMD's synchronization modules and 3D graphics accelerators
India's
new solar mission opening a floodgate of opportunities
Mitsubishi
selects ADI's SHARC processor for its automotive digital process
center
AWR incorporates
AMPSA's multimatch amplifier design tech into its microwave
office
Towerstream
deploys BridgeWave's 80 GHz links into its WiMAX backhaul
network
Airspan's
WiMAX products are FCC certified
Panasonic
and SEAS-NVE collaborated to improve house energy usage remotely
Given
Imaging's camera capsules employs Zarlink's wireless RF chip
Broadcom
acquires Dune Networks to get into cloud computing
Epson
Imaging's TFT LCD business sales function transferred to the
Sony Group
e2v's
Centre for Electronic Imaging in collaboration with Open University
Automotive-grade
semiconductor manufacturing by TSMC
Record
level sales of PON equipment according to Dell'Oro report
"Understand
digital power in one day" hands-on technical seminar
by Intersil in Germany
Surge
protection devices from Emerson meet UL safety standards without
need for modifications
Emerson
Network Power expands VME board portfolio with new ruggedized
models
MEMS microphones
from ST in the price range of electret microphones
3D Systems
acquires AdvaTech's manufacturing to extend its 3Dproparts
targeting military apps
China
Telecom selects Alcatel-Lucent to deploy first commercial
WAP & WEB Gateway
There
Corporation is new partner of Z-Wave Alliance
AeroScout's
Wi-Fi RFID solution powering Ultimo's hospital software
Infineon
and Nokia collaborated to develop advanced RF transceiver
solutions for HSPA
DENSO
designed and tested its robotic arms by using NI's measurement
tools
Mitsubishi's
LCD TV with Blu-ray disc recorder employs Marvell's Qdeo chips
Online
video-rich tutorial on DC power supply circuit design from
PI
Digi-Key
to sell Tusonix line of products from CTS
MEMC Electronic
Materials completes the acquisition of SunEdison
Researchers
can access MATLAB on TeraGrid
New Telefónica
HSPA+ network deployed with Sierra AirCard USB 307 modem in
Spain
Microsemi's
high power single-phase rectifier bridge modules are now DSCC
qualified
Mitel
Networks adds Microsemi's PowerDsine to its DataNet portfolio
Atmel
expands its 6-pin AVR Microcontroller family
Motorola
gains push-to-talk advantage by acquiring RadioFrame's iDEN
products
Austriamicrosystem
expands Multi Project wafer prototyping service
CDMA
and WCDMA patent arrangement agreement by MediaTek and Qualcomm
Roti maker,
bone screws, and website security wins Silicon Valley Entrepreneurial
Awards
Dune and
NetLogic validated the interoperability between their products
FormFactor
qualifies one-touchdown 300-mm wafer probe card for DRAM sort
test
Ericsson
announces completion of Nortel's acquisition in North America
EDGE Evolution
software from Ericsson adds 3G capabilities to GSM networks
12
design wins for Continuous Computing's DPI tech from network
equipment providers
YM Krishna
SSK produce renewable energy by employing GE Fanuc's control
system
FlashCORE
III programming solution from Data I/O wins 2009 global technology
Award
Mutare
selects Ditech's PhoneTag automated voicemail-to-text service
Hand gesture
based interface for remote control of TV
Toshiba
to expand use of Cadence tools for SoC design
TowerJazz
and Tanner EDA to deliver PDK for power management IC design
Aptina
did post layout verification of its image sensor design using
Fast 3D software
Toshiba
develops new photoresist tech for 20nm semiconductor fabrication
Toshiba
Semiconductor is transferring its chip assembly facility to
Nantong
Broadcom
supports WAPI in its WLAN ICs
NXP wins
Sanmina-SCI's best supplier award
Agilent's
new 1-Megawatt Solar Power System to save $3.5 million in
energy costs
Symmetry
to distribute Fujitsu's chip in Americas
Hynix Semiconductor's
2Gb DDR3 DRAM devices Validated by Intel
Semiconductor
equipment Book-to-Bill ratio above 1 from Jul to Oct 09
Semiconductor
packaging materials market to reach $20.1 billion by 2013
DRAM test
lab opened in Munich Germany
Cisco and
HP lead in fixed 10 Gigabit Ethernet switch segment
National
Micro. Institute names Powervation as best semiconductor startup
up of the year
Intel
invest to built 1000 times more powerful of current supercomputer
Westcode
Announces New 'Megawatt' press-pack IGBT transistors
Advanced
semiconductor chips at a price of a dollar and less
Semiconductor
revenue to drop by 11.4 percent in 2009: Gartner's reviewed
estimates
Learn about
LabVIEW at NI's conferences in Indian cities
Applied
Materials buys advanced semiconductor packaging expert Semitool
Digital
Imaging achieve first-pass silicon success in 22 days
Intel and
NEC join hands to develop supercomputer technologies
DNP, MPI
and Sony develop smartcard using biodegradable plastics
IP
and patents are the gold reserves of the semiconductor industry
Intel and
AMD race neck to neck in supercomputing domain
IEEE sponsored
HTC workshop discuss challenging technologies
Videocast
to learn techniques of powering Xilinx FPGAs
Over a
billion SoCs integrate flash memory interface IP components
from Arasan Chip Systems
ST Micro's
contactless chips to have NXP Semiconductor's technology
Sigma completes
acquisition of CopperGate Communications
Micronas
and University of Freiburg gets "f-cell Bronze Medal"
innovation award
ABI position
NXP Semiconductor at number one in contactless IC market
Touch
Micro-System employ Rudolph's software to improve yield in
MEMS devices
Silicon
Frontline's post-layout verification tool is validated by
UMC and TSMC
Tanner
EDA partner with SoftMEMS to support chip designers in India
Marvell's
semiconductor innovations in India targets broadband connected
smart gadgets
Element14
launched online resource for Microchip's XLP MCUs
Agilent
and Nexus deliver DDR3 memory bus debug solutions
IO-Link
reference design jointly by Atmel, HMT and MESCO
Cavium
Networks to acquire MontaVista Software
GigOptix
has acquired fables mixed signal IC supplier ChipX
Record
shipment of processor chips in 3rd quarter 2009
India targets
20 giga watts of solar power by 2022, AP leads
A team
formed in Europe to develop capacitors inside semiconductor
chips
Marvell
and E Ink collaborated to develop processors for e-readers
Internet
audio growth to drive demand for Class D and class G/H amplifier
ICs
Mentor
Graphics to unify silicon test and yield analysis
Indian
Telecom market: ITI and Intel right match for growth of wireless
broadband n/ws
ST Micro
and Mayo clinic collaborate on remote patient monitoring technology
Infineon
and TSMC are partnering to jointly develop 65nm embedded flash
process
Realtek
continues to buy Synopsys EDA tools
Elpida
share DRAM technologies with ProMOS in exchange of Foundry
Services
ON
Semiconductor reports 13% sequential growth in revenue in
3rd Q 2009
Semiconductor
revenues to drop by 11% in year 2009: SIA forecast
John Kelly
wins Robert N. Noyce award for his contribution to Semiconductor
Industry
NI Expands
HIL simulation platform for embedded control systems apps
SEMI powers
IC buyers to counter chip counterfeits with new standards
Samsung
stacks 8 32Gb NAND flash dies to form 0.6 mm thick single
device
Market
study says SiC & GaN devices to impact discrete power
semiconductor market
Avago's
critical IP enables Juniper Networks' development of silicon
devices
Newton
selects Broadcom's Bluetooth tech for its MoGo Talk wireless
headset
17% of
growth in silicon wafer area shipments in third quarter 2009
Advantech
supports Windows Embedded CE 6.0 R3 RTOS
SEMI released
database of Opto and LED manufacturers
ST
Micro and LG Display collaboration unveils iDP interface standard
for LCD TVs
Low resistance
tungsten metallization process for semiconductor chip manufacturing
IBM's x
servers employ LSI 6Gb/s SAS technology
Raytheon
awards TriQuint with a 4-Star Supplier Excellence Award (SEA)
FXI
and Atmel develops microSD gaming console for mobile phones
Semiconductor
assembly and test services provider Unisem's 3rd Q revenue
grew by 11.1%
WCDMA power
amplifier from Anadigics powers Samsung's 3G Handsets
Aldec opens
new office in Bangalore, India
SAMSUNG
to collaborate with Microsoft to save energy
Tower
Semiconductor outperforms global semiconductor fab business
Semiconductor
industry's fast recovery in 3rd Q 09 is due to processor and
DRAM demand
Delta Networks
taps Indian telecom and networking equipment market
Vishay
Nobel is now a partner of Schneider Electric's CAPP
Jennic
demos low-power ZigBee with the energy harvested from an electro-
mechanical switch
Onzo to
develop consumer displays for Echelon's utility metering services
Widex
employs Mentor's analog/mixed-signal simulators to design
its wireless chips
NVIDIA
adopts Synopsys Yield Explorer to reduce time to volume
Agilent
and Stanford University collaborating to explore new class
of nanoscale devices
Return
path receiver with DOCSIS 3.0 performance from Alloptic
Due
to faulty plastic molding Belkin recall its SurgeMaster surge
protectors
Enablence
sign $3.5 million agreement to develop PLC based components
for NGN apps
Cadence
low power design flow for SMIC 65nm process
Mitsubishi
selects eASIC's Nextreme ASICs for its Display Wall Cube Systems
Trident
adopts Mentor's Veloce platform for system-level verification
of its digital TV SoC
FormFactor
unveils 300-mm TouchMatrix probe card for NAND Flash devices
1
million Mustang EPON ONU chips shipped by TranSwitch
Open
Verification Methodology cookbook from Mentor Graphics' s
Mark Glasser
Indilinx,
Cavium and Narinet collaborated to bring SSD into networking
storage systems
Intersil
and Georgia Institute of Tech joint alliance for semiconductor
development
Intel
and Numonyx achieve stacking of PCM arrays to increase memory
capacity
Microsemi
to close manufacturing facility in Scottsdale, Arizona
15
-20% sequential growth of world's semiconductor revenues in
3rd Quarter of 2009
Aurora
PVIDESKTOP platform from Power-One for Aurora Photovoltaic
Inverters
MEMC
to acquire SunEdison
Sharp develops
35.8% conversion efficient solar cell by using triple-junction
compound
Cray
adopted Denali's Databahn PCIe 3.0 controller core and PureSpec
verification IP
Intrinsyc's
Windows Embedded CE 6.0 R3 with CerfBoard 270 reference designs
ST adopts
ARM Cortex-A9 MPCore processor for its home entertainment
equipment
BSNL
connectivity, HCL computers and Intel chips and tech; a powerful
combination
NXP
and Avni collaborate to develop LED based street lighting
solutions for India
Open-Silicon,
MIPS and Virage Logic achieves 65nm ASIC processor design
Medical
electronics firms employ advanced Bluetooth to access patient
data wirelessly
National
Semiconductor adds more distributors for its PV solar solutions
Circuit
Emulation products from Zarlink semiconductor wins MEF 18
certification
LSI and
Supermicro collaborates to offer end-to-end 6Gb/s SAS solutions
Carrier
Grade QuickSec 5.0 toolkit integrates Cavium Networks OCTEON
and Multi-core support
ARM
and Mentor collaborates to support Nucleus RTOS/Graphics software
CoWare
partners with ARM to provide AMBA Network Interconnet based
SoC designs in SystemC
Cadence
and ARM joining hands to develop SoC design flow
Ericsson
and Samsung working together to make their LTE devices and
networks interoperable
E Ink and
Freescale are partnering to develop embedded processors for
eBook market
Aeroflex
/ Metelics wins DSCC Certification for their small signal
zener diodes
Ixia
to acquire Agilent's N2X Data Networks Product Line
Novatek
licenses the MIPS32 24KEc processor to power SoC designs for
digital home
NIST adopted
CableLabs SMA specifications for its Smart Grid networks
TSMC opts
for Mentor's Calibre physical verification platform for its
Integrated Sign-off Flow
Single-chip
STi5197 cable STB decoder IC from ST Micro is opted by Chinese
STB vendors
Methanol
fuel cell based external power source from Toshiba for mobile
devices
Semiconductor
revenue update: a bit of motivating figures
New Mobile
Memory Initiative with breakthrough power efficiency from
Rambus
European
research project "BioP@ss" aims to develop electronic
ID card in chip card format
ADT security
services is the new member of Z-Wave Alliance
New ALR-9900-EMA
reader from Alien deploys EPC Gen 2 RFID solutions
SP AusNet
select Motorola's mobile broadband tech to power WiMAX-based
smart metering apps
Extreme
Networks and Motorola collaborates to provide secure, fast
802.11n services
SAMSUNG
Electronics' TV chip for North American mobile digital TV
Newark
to sell, support and stock austriamicrosystems' Analog ICs
CTS wins
$22 million production program from Japanese automotive manufacturer
Cavium's
processor powered TeamF1's security gateway drives Netgear's
VPN firewall
MontaVista
now supports 4G wireless networks with OpenSAF capabilities
Novellus
unveils SABRE Excel platform for 22nm copper electroplating
MagnaChip
offers 0.11um, 30V process technology with small SRAM cell
size
Octasic's
enhanced Vocallo MGW multicore processors support advanced
video features
Logic
Devices is sampling its first DDR2 DRAM modules
TriQuint
wins $16.2M DARPA contract to develop GaN circuits for defense/aerospace
UMC completes
EPD verification for its 200mm IC wafers
Joint collaboration
enables ARM processor and intrachip bus IP on Xilinx FPGAs
New China
website launched by Exar
Cochlear
and NXP collaborates to design Cochlear's Hearing Implant
devices
Cray selects
Gennum's Snowbush PCIe 3.0 PHY IP for its supercomputer design
NXP
Semiconductor and Infineon are sharing much of the ePassport
market pie
GLOBALFOUNDRIES
picks Mentor for IC manufacturing related EDA software
BittWare
Receives Production Order for NG STARLite Program
Wind River
VxWorks MILS Platform 2.0 for GE Fanuc's single 3U VPX computing
platform
GE Fanuc
secured $1 million order to upgrade Northrop Grumman's IAS
Pace Embedded
Systems Lab at R.V. College of Engineering, Bangalore India
SMIC extend
its 45nm CMOS technology to 40nm and 55nm
Qdeo video
processors from Marvell win 2009 TV Innovation Award
New standard
from SAE to enable Ethernet for critical embedded systems
Audi's
car audio systems powered by NXP's HD radio chips
Joint hardware
and software platform for IPTV over broadband network
New memory
cards from Samsung Electronics are introducing in this month
at Taiwan
Quanta
selects Tilera's 64-core processor for cloud computing
IBiquity
selects Atmel's AVR Microcontrollers for HD radio reference
design platforms
New Innovation
to boost efficiency of fuel cells from MIT team
LG Electronics
implements Rayspan's metamaterial antenna in its mobile phones
Aeroflex
adds new LTE measurement capabilities to its PXI platform
Marvell
supports new "Wi-Fi Direct" standard for 802.11
WLAN devices
AMIMON
employ Sidense's OTP tech in chips used for WHDI
GigOptix
now shipping pre-production quantities of 40G EO polymer modulators
Sigma Designs
to acquire CopperGate Communications
Notebook
and netbooks propel Intel back into growth path
Aeroflex
3280A spectrum analyzers added with 30 MHz digital demodulator
at no extra price
Infineon
maintains number one position in Chip-card semiconductor market
Mentor
Graphics to acquire PCB manufacturing software vendor Valor
IPTV set-top
box from Amino now powered by Intel Atom based CE4100
TSMC-qualified
Electromagnetic simulator from Agilent for RF design in 65
nm process
Instat
says GPS enabled phones to capture PND market opportunities
NXP Semiconductor
and Virage Logic go for a long-term give and take relationship
Joint strategic
initiative from AMD and CyberLink to accelerate CyberLink
apps
Allegro
MicroSystems phasing out its wafer fab operations by mid-2012
Incap plans
to extend its design unit in India
Radio platform
streaming new-gen Internet content from Ensigma and Imagination
Tech
Researchers
getting closer to integrating nanowires on CMOS semiconductor
chips
Fresco
are Entropic are partnering to develop hybrid receivers for
modern TVs
UMC Fab
12i migrates its manufacturing process to 45/40nm
Microsemi
wins $2 million contract to develop SiC RF components for
Avionics apps
Joint RF4CE
development platform from TI, C.G. Development and Quanta
Echelon
and Eaton collaborate to provide Smart Grid solutions in homes
Joint strategic
initiative from AudioCodes and BroadSoft for IP voice network
solutions
ST Micro's
first-pass silicon success by utilizing Synopsys DesignWare
solutions
Cavium's
NITROX PX security adapters deployed in Hitachi's blade server
systems
Elpida
memory completes the development of the 40nm 2-gigabit DDR3SDRAM
GE Fanuc
deploys NVIDIA graphics processing units (GPUs) on its new
hardware products
JDSU shipped
more than 100 Q Series UV lasers for the scribing of LED wafers
NREL adopted
Synopsys' Sentaurus TCAD to simulate solar cell performance
Dongfeng
employs MathWorks tools to design hybrid-vehicle battery system
More than
8,000 instrument drivers through Instrument Driver Network
from NI
DSCC qualification
granted to Microsemi's SMT power schottky diodes
Novellus
extend SPEED Max STI manufacturing process to 32nm technology
node
Dialog
Semiconductor's ICs to power-manage NEC's multimedia processors
ORBCOMM
selects Sierra Wireless for its M2M web services platform
Philips
IntelliVue Patient Monitors wins Aruba's interoperability
certification
Enel selects
ST Micro chips for its electronic power meters
Premium
Wi-Fi Service jointly by Qualcomm and Wandering
Joint AUTOSAR
3.0-compatible solution from NEC Electronics and KPIT Cummins
Freescale
and ST Micro together launched 32-bit MCU for automotive electronics
Trident
acquires NXP Semiconductor's TV and STB IC business in exchange
of Trident's stocks
PERC Java
virtual machine supports BeagleBoard for real time embedded
systems
Quatech
acquires Socket Mobile's SocketSerial devices business
0.18 micron
CMOS process from ON Semiconductor for digital and mixed-signal
ASICs
Eurotech
received $1.8 million order from Cadec for fleet management
embedded tech
PDK for
GaAs pHEMT and HBT process from AWR and WIN semiconductor
Microsemi
joins PoE technology consortium
'Common
Platform Technology' qualifies Synopsys IC Validator for 32-nm
design rule
Broadcom's
Wi-Fi reference designs are selected for the Wi-Fi CERTIFIED
n Test Bed
Panasonic
and Renesas collaborating on 28-32nm SoC process tech at Renesas
Naka site
Jade graphics
chip from Fujitsu powering 'virtual image' cluster of Jaguar
Range Rover
McObject's
eXtremeDB embedded DB software is selected by defense/aerospace industry
Accellera
approves an interoperability guide helping design re-use of
IP components
Joint development
of LTE based mobile-terminal platform
CTS to
supply throttle position sensor to one of the India's leading
motorcycle maker
Sierra
Wireless integrates Anyware Tech to enhance its M2M solution
capabilities
Radiocrafts
and Sierra Wireless jointly launches gateway for smart meters
Achived News (2009)
Achived News (2008, 2007, 2006)
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