Mobile phone ICs Last update: 2nd June 2010
Top Stories
ANT+ and TI working together in connecting low power sensors to smartphones
Samsung selects Broadcom's 'Combo' Chip to drive its new mobile handsets
ST-Ericsson building support for Adobe Flash Player10.1 on its smart-phone chips
Smatphones adopt Trusted Foundations in big way
LG selects Dialog Semiconductor's power management IC for Android Smartphone
Dell'Oro reports 10% of decline in China mobile infrastructure market in third quarter 09
Mutare selects Ditech's PhoneTag automated voicemail-to-text service
FXI and Atmel develops microSD gaming console for mobile phones
WCDMA power amplifier from Anadigics powers Samsung's 3G Handsets
Methanol fuel cell based external power source from Toshiba for mobile devices
SAMSUNG Electronics' TV chip for North American mobile digital TV
LG Electronics implements Rayspan's metamaterial antenna in its mobile phones
Instat says GPS enabled phones to capture PND market opportunities
Joint development of LTE based mobile-terminal platform
Samsung adopting Skyworks' RF front-end devices to power its 3G mobile handsets
Fujitsu is now shipping SAW filter-less 3G transceiver for mobile phones
Myriad's homescreen widget solution for low cost mobile phones
Freescale's new unified common platforms enable 3G to support LTE and other 4G standards
Zarlink's VE880 chipset powers Gigaset mobile convergence product
SPMT's abridged technology specifications for mobile devices
ARM, Chartered, IBM, Samsung, and Synopsys joining hands to develop next level 32/28nm Mobile SoCs
IC supporting environment and money saving mobile phone charging adapters
Ericsson completes delivery of new GSM base station hardware to VodaFone Essar
Intel processor chips inside Nokia phones
TI's processors to support femtocell software from Continuous Computing and mimoOn
Motorola and Vocera to provide wireless VoIP smart phones for medical-staff
LG selects touchscreen solution from Cypress Semiconductor for KS360 mobile phone
Q4 2008 revenues freeze semiconductor industry to a dope less silicon
Cypress Semiconductor's new module can download a movie to a phone in a minute
Fabless wireless IC vendors SiRF and CSR are merged
Alvarion to demonstrate WiMAX broadband at Mobile World Congress event
ZTE unveils new Unified Open Environment platform for telecom operators
Single-Chip GPS receiver jointly developed by Seiko Epson and Infineon
TRIQUINT Semiconductor posts impressive full year 2008 results
Broadcom EDGE Platform gets a customer
ZTE launching new telecom technologies at brisk pace
Broadcom WiFi/Bluetooth software supports Google's Android platform
Centillium acquisition add up to the TranSwitch revenue growth in 4Q08
ST Microelectronics has bought NXP's 20 % stake in ST-NXP Wireless JV with Ericsson mobile
China's ZTE aims to be one of top 3 GSM vendors in this year
A new finger vein authentication called "mofiria" from Sony for laptops and phones
WiMAX IC market opportunities in India
Qualcomm and LT Mobile sign CDMA subscriber unit license agreement
Wireless IC expert Marvell revises its Q4 fiscal 09 financial outlook
ZTE products receive WiMAX Forum 3.5GHz Wave2 certification
U.S. ITC has affirmed infringement ruling against SiRF on GPS-related patents
ST Microelectronics and Paratek to jointly develop tunable products for mobile phones
A new security system to watch real time video of home/office on phones
Broadcom demonstrates Bluetooth at data-rates of 24 Mb/sec
Qualcomm and Tianyu sign 3G subscriber unit and modem card license agreement
NXP and Renesas expand license agreement on NXP's MIFARE technology
Infineon and Micron to develop high-density subscriber identity module (HD-SIM) cards
Qualcomm opens test center in Singapore
ZTE Selects Cavium's OCTEON processors for 3G routers
Enea's OSE RTOS to support for AMCC's PowerPC architecture
India is playing important role in WiMAX success
Security tools for any unauthorized data transfer through USB flash drive
Elpida and NEC to form a new company to exclusively manufacture Display Driver ICs
OpenKODE 1.0 specs from Khronos to develop media apps on mobiles
Micron has acquired image sensor business of Avago Technologies. Qualcomm expands it's WLAN portfolio by acquiring Airgo
Anadigics, The “powerful supplier” of mobile rf power amplifiers has shipped production volumes of it’s power amplifiers to Nokia and Samsung.
New Products
Active Noise Canceling (ANC) ICs for mobile-phone headphones
Bidirectional current-limit device to protect phones from faulty charging
New HSPA+ chip solution from Infineon for 3G smart phones
TriQuint Semiconductor expands its RF portfolio for 3G/4G
Dual-band CDMA power amplifier from Anadigics for mobile handsets
RF power amp modules from Triquint Semiconductor for WCDMA and GSM/EDGE
'3G phone-on-a-chip' from Broadcom targets low cost smartphones
SoC with CMOS sensor from NEC Electronics for camera phones
Smart-reset chip from ST Micro to restart system-crashed phones and devices safely
ST Micro announced quarter-inch 5MP CMOS image-sensor roadmap for mobile phones
New GPS location processor with built-in CPU from CSR
Miniature dual band power amplifier modules for mobile apps from Avago
3.3V, 2.5Gbps single-chip transceiver for GEPON and GPON ONU/ONT module apps
New Single-chip for Bluetooth, FM and GPS and a WLAN IC for mobile phones
Dual-downconverting SiGe mixers with high linearity for wireless base stations
UMTS femto base-station devices with PHY interface for WCDMA/GSM networks
CMOS transmit module for mobile handsets from Amalfi Semiconductor
RF power devices for TD-SCDMA wireless networks from Freescale
CM6100 from CMD provides ESD protection for mobile handset interfaces
The new protection IC from ST Micro for headphones of mobile phones
ADI's new white LED flash driver for mobile-phone cameras
Dual LDMOS integrated power amplifiers supporting doherty mode
New Doherty amplifier based on the LDMOS transistor
Current sensors for smart phones and netbooks
ST-Ericsson's single-chip solutions for low cost mobile phones
Atmel's low priced touch sensor IC for mobile phone has 4 o/p channels
New magnetic sheets with high permeability for mobile phones and portables
ESD protection devices for mobile phones
Miniature FM antenna in the form of surface mount chip for mobile phones
New UMTS femto base-station transceiver chipset
Hall effect switch with microwatt power consumption for mobile phones
WCDMA power amplifiers with integrated directional couplers
LTE power amplifiers and FEMs for 4G handsets & PC cards
New 3G-platform solution enables enhanced mobile Internet access
Integrated multimedia SoC & flash platform for mobile phones
TI to sample new multicore OMAP SoCs for mobile devices in mid-09
New HSPA+ chipset for 3G mobile phones
Mobile phone chip for mass smart phone market
RF module for 3G Internet access on either HSPA or CDMA2000
Bluetooth, GPS and FM radio in a 65nm SoC device
NXP's doherty amplifiers for CDMA basestations eliminates extra tuning
Low cost single chip GSM mobile phone IC
2G/3G/LTE RF transceiver supports data rates up to 150 Mbps
Small size filter devices to protect LCD screens on 3G phones
3G transceiver IC for femtocell base-station with FMC service
P-Channel MOSFET in CSP for slimmest cell phones
4-Channel LED drivers targets entry-level cell phones
32-bit ARM-Based MCUs for cellular-phone SIM cards
Integrated battery charger for cell phones and bluetooth devices
Fully integrated frequency translator for in wireless communications
Radio IC with GPS RF front end and bluetooth 2.1 + EDR controller
Agilent's new Ultra Mobile PC solution for handheld wireless measurements
New 17 to 34 GHz up-converter from Mimix Broadband
Fujitsu to release Wimax chipsets for mobile phones
Wi-Fi, Bluetooth, and RF front-end in a single chip
Samsung's new 8GB NAND is shipping in samples to mobile-phone makers
Three core DSP from TI for CDMA base stations
CDMA phone Single chip IC to support EV-DO. Neomagic's TV companion chip for mobile phones. AAT2830/31 does all the lighting functions for the cellphone. Intel’s WIMAX SOC supports both fixed and mobile networks. New Wimax Transceivers from NXP
Cypress has improved the performance of capacitor sense interface devices.
Toshiba’s 3.2 and 2.0 Mega-pixel image sensors with built in image processor.
