Computer
Panasonic Nessum Approved as IEEE 1901-2026 Standard for Energy Management Applications
Panasonic Holdings Corporation has announced that Nessum, its communication technology for energy management and infrastructure applications, has been approved as the international standard IEEE 1901-2026. The approval was granted by the Board of Directors of the IEEE
3 min read
NVIDIA Launches OpenShell Reference Architecture for Enterprise AI Agent Safety
NVIDIA has announced the NVIDIA OpenShell Reference Architecture, a full-stack infrastructure for building, containing, observing and enforcing safe agents across enterprise infrastructure and edge systems. For agentic workloads, NVIDIA Vera Rubin NVL72 systems delive
3 min read
Nokia Advances AI-RAN and Launches Agentic AI Platform With NVIDIA for Telco Autonomy
Nokia has announced new AI-RAN capabilities with NVIDIA and launched a sovereign agentic AI platform for telco autonomy across network operations. The capabilities apply AI within radio processing, support intelligence close to where data is generated and extend gover
4 min read
Marvell Launches Six-Channel Structera X CXL 3.2 Memory Expanders for AI Inference
Marvell has announced the second-generation Structera X 3406 (MV-SLX34061) and Structera X 3506 (MV-SLX35061), six-channel CXL 3.2 memory expanders designed to address memory demands in AI inference workloads. The Structera X 3406 supports DDR4, while the Structera X
3 min read
SK hynix Presents CXL Memory-Centric AI Rack Systems at OCP Global Summit 2026
SK hynix presented next-generation memory solutions for AI infrastructure at OCP Global Summit 2026, including a 256GB CMM-DDR5 module based on CXL 3.2. The event took place October 12-15 in San Jose, California. The company said th
4 min read
GlobalFoundries Selected to Operate Two New Semiconductor Fabs in New York
GlobalFoundries has been selected to operate two new semiconductor fabs at its Malta, New York, site under a U.S.-Japan initiative providing up to $21 billion in funding. The first fab will be a 300mm facility expected to come online in 2029.
3 min read
Marvell, Microsoft and Oracle Form OCP Group to Standardize Data Center Hardware Security
Marvell Technology, Inc., Microsoft Corporation and Oracle have formed an Open Compute Project (OCP) working group to standardize integrated hardware security for cloud and hyperscale data centers. The effort aims to define a NIST FIPS 140-3 Level 3 integrated hardwar
3 min read
TrendForce Projects 2027 CSP CapEx Above $1.5 Trillion and AI Server Revenue Growth Over 90%
TrendForce projects AI server revenue will rise more than 90% YoY to nearly $920 billion in 2027, as shipments and prices increase. Combined CapEx among the world’s nine leading CSPs is projected to surge 106% YoY to US$957 bi
3 min read
Texas Instruments Unveils ADC34DSO75 for Nanosecond AI Data Center Telemetry
Texas Instruments has introduced the ADC34DSO75, a 3 gigasamples per second (GSPS) analog-to-digital converter (ADC) for 24/7, low-power, event-based remote monitoring of AI data center power rails at nanosecond resolution. As
4 min read
Tower Semiconductor and Semtech Expand SiGe Agreement for AI Data Center Interconnects
Tower Semiconductor and Semtech Corporation have expanded a multi-year agreement that secures dedicated silicon germanium (SiGe) capacity for Semtech's AI data center optical interconnect components. The companies describe power as
3 min read
AMD Details Helios Production and Helion Rack Plans for Agentic AI at OCP 2026
AMD CEO and Chair Lisa Su outlined the company’s open, full-stack infrastructure portfolio for agentic AI at the opening keynote of the 2026 OCP Global Summit in San Jose, California, on October 12, 2026. The portfolio spans systems from enterprise deployments t
3 min read
AMD Introduces Helion Rack Blueprint for Hyperscale and Enterprise Agentic AI Compute
AMD has introduced the AMD Helion agentic AI rack, an open blueprint for agentic AI infrastructure with CPU-only hyperscale and combined CPU/GPU enterprise configurations. Based on an Open Compute Project (OCP) spec-design, Helion c
2 min read
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