Electronics Engineering Herald                 
Home | News | New Products | India Specific | Design Guide | Sourcing database | Student Section | About us | Contact us | What's New
Processor / MCU / DSP
Memory
Analog
Logic and Interface
PLD / FPGA
Power-supply and Industrial ICs
Automotive ICs
Cellphone ICs
Consumer ICs
Computer ICs
Communication ICs (Data & Analog)
RF / Microwave
Subsystems / Boards
Reference Design
Software / Development kits
Test and Measurement
Discrete
Opto
Passives
Interconnect
Sensors
Batteries
Others

New Products

  Date: 12/01/2014

Single chip GPS IC supports multiple navigation satellites

STMicroelectronics has announced that its Teseo III, a single-chip standalone positioning product family capable of receiving signals from multiple satellite navigation systems, including the Chinese BeiDou, the US GPS, European Galileo, Russia’s GLONASS and Japan’s QZSS.

The new Teseo III with improved positioning accuracy and also leverages the Company’s investment and support for sensor fusion as found in Automotive Dead Reckoning and Assisted-GNSS (Global Navigation Satellite System) functions.

“By adding the BeiDou satellite-tracking capabilities to existing support for all global systems, the Teseo III delivers greater accuracy and location precision in Asia and throughout the world,” said Antonio Radaelli, Director Infotainment Business Unit at STMicroelectronics. “Teseo III allows in-car navigation systems, telematics systems, portable, marine, fitness, and other devices needing to use the best signal from any system to deliver outstanding accuracy across urban, rural and mountainous environments.”

The Teseo III product family is offered in two series:
The STA8089 series adds support for the BeiDou constellation to devices that remain pin-to-pin compatible with the Teseo II series, to enable fast customer-application migration.
The STA8090 series adds a new, more efficient power-management unit, along with support for China’s BeiDou satellites.

The Teseo III product family provides a single-chip solution integrating the RF, digital control circuits and flash memory, to enable simultaneous tracking of multiple satellites regardless of their constellation and to deliver exceptional accuracy in urban canyons, where building and other obstructions make satellite visibility challenging. Like other products in the Teseo family, Teseo III combines high positioning accuracy and indoor sensitivity performance with powerful processing capabilities and superior design flexibility.

The Teseo III is now in qualification and will be available for sampling to customers in Q1 2014.



 
ADVT
Home | News | New Products | India Specific | Design Guide | Sourcing database | Student Section | About us | Contact us | What's New
©2010 Electronics Engineering Herald