Integrated audio codec introduced by TI for mobile devices

Texas Instruments Incorporated has introduced the integrated audio codec TLV320AIC3262 with embedded miniDSP cores that provides echo and noise cancellation at voice sampling rates up to 16 kHz.

The TLV320AIC3262 integrates five amplifiers and two miniDSP cores. The designers can interface up to three devices simultaneously, such as application, Bluetooth and baseband processors. The codes can receive, mix and process the audio and voice samples.

Features and benefits of the TLV320AIC3262
1. 3rd generation miniDSP technology creates clear, high-definition voice quality for circuit-switched or VoIP calls, including video conferencing applications
2. SRS WOW HD included improves audio playback quality and enables faster processing.
3. 3 asynchronous audio buses plus asynchronous sampling rate conversion (ASRC) can connect to multiple audio sources and mix multiple sample rates.
4. Intelligent speaker protection algorithms control voice coil temperature and diaphragm excursion to enable maximum possible loudness without damaging the speaker.

The TLV320AIC3262 is available now in a 4.8x4.8 mm WCSP package and is priced at $4.95 in quantities of 1,000.

The TLV320AIC3262EVM-U allows designers to evaluate the TLV320AIC3262's operation, priced at $299.

For more information, visit http://www.ti.com/tlv320aic3262-pr