8 new semiconductor equipment products from Applied

Applied Materials, Inc has introduced eight semiconductor manufacturing products over the last few weeks. They include:
1. Reflexion GT CMP for tungsten: For fabricating the transistor contacts and vias in advanced DRAM, NAND and logic devices
2. Vantage Vulcan RTP: Annealing equipment for doping semiconductor material
3. Centura DPN HD : Plasma nitridation and post-nitridation anneal (PNA) chambers
4. Endura Versa XLR W PVD: Enables deposition of tungsten films with the lowest-available resistivity
5. Endura HAR Cobalt PVD: Integrates Siconi pre-silicide clean with PVD cobalt and TiN cap deposition for the direct contact application in the DRAM periphery
6. Centura Integrated Gate Stack: For creating the critical gate dielectric structures in 22nm logic chips
7. Producer Black Diamond 3: Nano-porous low-k film for the 45/32nm copper/low-k interconnects and
8. Producer Nanocure 3: Designed to work with the Applied Producer Black Diamond 3

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"We are excited to be announcing new semiconductor technologies for manufacturing some of the most critical and challenging structures in our customers' new chip designs," said Mike Splinter, chairman and chief executive officer of Applied Materials. "These products from our Silicon Systems Group will enable chipmakers to address the inflections in new materials and architectures that will usher in a new era of high performance and functionality to satisfy the relentless demand for smarter, more connected mobile devices."

"The drive for greater speed and power efficiency is pushing the boundaries of scaling to find new solutions for our customers that enable manufacturing down to the atomic level with incredible precision and control," said Dr. Randhir Thakur, executive vice president and general manager of the Silicon Systems Group at Applied Materials.

"Process complexity has increased considerably and our multi-technology portfolio of products provides customers with integration solutions that can lower their process development times. Deep and early engagements with customers and R&D centers worldwide have enabled us deliver differentiated products for manufacturing advanced transistors, interconnects, 3D architectures and packaging. This is exactly where Applied's continued innovation and experience enable us to lead and excel."