electronics engineering Herald                                          
Home | News | New Products | India Specific | Design Guide | Sourcing database | Student Section | About us | Contact us | What's New
Processor / MCU / DSP
Memory
Analog
Logic and Interface
PLD / FPGA
Power-supply and Industrial ICs
Automotive ICs
Cellphone ICs
Consumer ICs
Computer ICs
Communication ICs (Data & Analog)
RF / Microwave
Subsystems / Boards
Reference Design
Software / Development kits
Test and Measurement
Discrete
Opto
Passives
Interconnect
Sensors
Batteries
Others

Date: 6th Feb 2011

New femtocell SoC chip from Picochip supports eight users

Picochip released its next generation of picoXcell femtocell chips, the PC3008 optimized for high-volume cost-sensitive consumer applications.

The ARM11 processor powered PC3008 with Picochip's PHY interface supports eight users with Release 7 HSPA+ (21Mbps downlink, 5Mbps uplink) and is already approved by many operators. PC3008 is manufactured using 40nm process technology integrates the key components of a 3G femtocell into an aQFN package just 12mm (0.5inch) square enabling design of complete HSPA+ femtocell 3G basestation in a USB dongle.

"The rise of the femtocell is causing a fundamental rethink in the way we build, run and use mobile networks," commented Picochip CEO Nigel Toon. "Picochip's technology is in the vast majority of femtocells deployed today, driving and enabling that change. With the PC3008 and the forthcoming devices we are extending our leadership: As well as an industry-leading silicon design, we have invested heavily in system test to guarantee the most robust PHY available and the most complete reference design."

"In 2010 we saw 17 operators offer femtocells commercially, with over 1 million units shipped: that is expected to accelerate swiftly going forward in 2011," said Aditya Kaul, Practice Director, Mobile Networks at ABI Research. "Residential femtocells form the largest segment of deployments so far and is expected to remain the dominant market going forward. With smaller form factors and reducing costs, the integration of femtocells with home gateways becomes much more likely. Although we have seen increasing competition in the femtocell silicon market, Picochip remains in a strong position for the UMTS/HSPA femtocell segment and the new USB form factor is proof that they continue to innovate, push the boundaries and drive carriers to adopt femtocells much more aggressively going forward."

According to ABI's most recent report, there were 1.3M femtocells shipped in 2010, rising to 70.2 million in 2015, a 154% CAGR.

The PC3008 will be shipping in volume by end of the year. Other devices in the PC3xxx family will be announced later this year.


 
Home | News | New Products | India Specific | Design Guide | Sourcing database | Student Section | About us | Contact us | What's New
©2010 Electronics Engineering Herald