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Date: 09-04-14

ASE partners with Inotera to strengthen SiP packaging capabilities

Advanced Semiconductor Engineering (ASE) is partnering with Inotera Memories to strengthen ASE’s System-in-Package (SiP) capabilities. Inotera to provide manufacturing services for silicon interposer, an interconnect device on silicon wafer for 2.5D IC solutions. Together with ASE’s electronic manufacturing services (EMS) subsidiary, Universal Scientific Industrial (USI), ASE said it is offering customers a complete SiP solution, encompassing design to manufacturing to logistical integration. SiP technology is integral to many end market applications including products incorporating biometric touch, sensors, wireless, power management, camera modules, RF front end and lighting, all of which are prevalent within today’s vast technology landscape. “ Inotera hopes to contribute our high-quality and cost-effective manufacturing capability to ASE’s SiP solution through the collaboration,” said Dr. Scott Meikle, President of Inotera. “By combining strengths complementary and maintaining a full commitment to our DRAM capacity, Inotera and ASE can provide an enabling capability to the semiconductor supply chain,” emphasized Dr. Meikle. “ ASE recognizes that collaboration within the supply chain is critical to the success of our vision for system integration, and it is through the establishment of strong partnerships that we can work together to bring optimum value and just-in-time solutions to our customers,” said Dr Tien Wu, Chief Operating Officer, ASE Group. He continued, “Inotera is a proven leader in DRAM wafer fab technology and has expanded their capabilities to offer silicon interposer foundry services to benefit ASE’s complete SiP solution. ASE’s dedicated R&D team is developing proprietary IC packaging IPs, working with various material and equipment suppliers, as well as customers to further expand and strengthen our SiP portfolio.”

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