The new high temperature resistant MLCC chip capacitors with soft terminations from TDK for automotive applications employ electrodes made of conductive resins that provide effective protection against solder cracks caused by thermal cycling, flex cracks caused by stress to the PCB, and damage due to vibrations and shocks. CGA series use X8R dielectric material for stable capacitance values (±15 percent) at higher temperatures from -55 °C to +150 °C.
CGA series available in package sizes of IEC 1005 (EIA 0402) to IEC 3225 (EIA 1210) and in capacitance range 150 pF to 10 µF and rated voltages from 16 V to 100 V.
TDK claims CGA series is the world’s only X8R soft-termination MLCC in an IEC 1005 package. CGA series components are designed for ECUs used in high temperature environments such as engine compartments and in smoothing and decoupling circuits. Mass production of the new MLCCs, which are qualified to AEC-Q200, will start in June 2015.
"Modern cars increasingly rely on electronic systems and implement electric operation, which has led to a drastic increase in the number of electronic components found in such vehicles. At the same time, there is a strong trend towards locating electronic control units in the engine compartment or near other structural parts in order to gain more space for passengers. Electronic components used for such applications must be able to withstand high temperatures and severe vibrations. The new MLCCs retain all the advantages of existing soft-termination products and are fully compliant with the industry's most stringent X8R specifications." explains TDK.