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Date: 10-09-13

Interposer card from Teledyne Lecroy for analysis of SSDs

Teledyne LeCroy has made available of an interposer card for analysis of M.2 Solid State Disks (SSDs) that utilize the new M.2 specification and PCI Express (PCIe) protocols developed by the PCI-SIG. The M.2 Interposer Card, which is used with Summit Protocol Analyzers, enables PCIe bus traffic between a system board or tablet and a M.2/NGFF connector on a SSD device to be monitored, captured, and recorded for protocol analysis. The M.2 interposer will support analysis for PCIe host interfaces such as SATA Express (AHCI/PCIe) and NVM Express (NVMe) at data rates from 2.5 GT/s up to 8 GT/s, and lane widths of x2 and x4.

"Focusing on PCIe storage devices and systems testing, Teledyne LeCroy has put together a compelling solution for developers. The M.2 Interposer is not only effective in tapping high speed signals in the system but it also is flexible enough to support 22mm SSD devices providing great value for developers," said John Wiedemeier, Product Marketing Manager in the Protocol Solutions Group, Teledyne LeCroy. "This probing solution will support SATA Express devices today and will support high speed NVMe SSD devices when they become available."

"The M.2 SSD module provides a compact storage form factor for new computing systems, and can accelerate the transition to PCI Express attached SSDs," said Jim Pappas, Director of Technology Initiatives, Intel Corporation. "The M.2 interposer and PCI Express protocol analyzer from Teledyne LeCroy provides a tool for developers to test and tune M.2 SSD modules in their new platforms."

The M.2 interposer provides connectivity and monitoring capability using a PCI Express protocol analyzer for SSD devices targeted at mobile, desktop and enterprise platforms that utilize this new form factor. M.2 SSD devices come in two socket types which will be supported with two different interposer boards. One interposer will support socket 2 type devices that focus on PCIe x2 SSDs, and the other interposer will support socket 3 types that focus on PCIe x4 SSD devices. Each interposer will support 42mm x 22mm, 60mm x 22mm, 80mm x 22mm, and 110mm x 22mm SSD sizes. To use the interposer, the SSD device is inserted into the interposer and a M.2 connector probe board that extends the PCIe signal path is inserted into the host M.2 slot. The interposer taps all PCIe protocol traffic between the host and the SSD device, and records it using the Summit Protocol Analyzer, where protocol issues and performance metrics can be analyzed and debugged.

"The new M.2 form factor specification is essential for developing power-efficient, high-performance tablets, thin and light laptops and other devices targeted for consumer and enterprise markets," said Al Yanes, PCI-SIG Chairman and President. "We are pleased that Teledyne LeCroy continues to support the PCI-SIG by developing probing solutions for form factors such as those based on the M.2 connector."

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