New surface defect inspection system from
KLA Tencor for semicon wafers
KLA-Tencor Corporation has announced its latest generation
in the Surfscan family of wafer defect and surface quality
inspection systems: the Surfscan SP. The Surfscan SP3 platform
is also designed for extension to the next wafer size: 450mm
says KLA-Tencor.
"Launching a new Surfscan platform is an exciting
event for KLA-Tencor," said Ali Salehpour, senior vice
president and general manager of the Surfscan / ADE division
at KLA-Tencor. "The visible-light Surfscan SP1 and
the UV-illuminated Surfscan SP2 were well received by the
industry; in fact, Surfscan tools can be found in every
leading-edge substrate and chip manufacturing facility.
Now we're announcing the first DUV unpatterned wafer inspection
platform, to satisfy the industry's need for increased sensitivity
at production speeds at the 28nm device node and below.
We believe that the Surfscan SP3 will carry the Surfscan
reputation for excellence in substrate and integrated circuit
(IC) process tool qualification into the next generation."
KLA-Tencor explains that, the Surfscan SP3 system is designed
to help develop and manufacture substrates for < 28nm
devices that are nearly atomically smooth and free from
polish marks, crystalline pits, terracing, voids or other
defects that disrupt the electrical integrity of the transistor.
KLA-Tencor's engineers have built the Surfscan SP3 inspection
system with the DUV sensitivity and throughput needed to
reliably identify critical defects and surface quality issues
inline during substrate manufacturing.
KLA-Tencor says the IC fab manufacturers must be able to
monitor rough and smooth unpatterned films after deposition
and chemical mechanical polish (CMP) to ensure that process
tools are not adding defects. The Surfscan SP3 leverages
its unique DUV wavelength, special apertures and multiple
illumination and collection channels to address stringent
28nm node requirements for defect detection and classification
on blanket films at production speeds. The SP3 also offers
a module that inspects the back side of wafers for defects
that might deform the wafer shape during photolithography.
Key features and improvements of Surfscan SP3 over the
current-generation Surfscan platform as per KLA Tencor includes:
Powerful DUV source and DUV-optimized optics, to help capture
critical defects affecting devices at the 28nm node and
below;
New stage and new image computer that, together with algorithm
improvements, enable increased production throughput;
DUV-specific apertures that enhance defect capture on blanket
films;
Integrated, high resolution (~100 mega-pixel), full-wafer
SURFmonitor haze maps, providing automated capture of ultra-fine
slip lines and scratches or maps of surface roughness, grain
size and other process parameters; and
Defect coordinate accuracy improvements that enhance re-detection
and speed of defect review and classification on KLA-Tencor's
eDR electron-beam review tools, allowing engineers to track
down the source of a defect excursion quickly and disposition
wafers accurately.
KLA-Tencor says Surfscan SP3 tools can be matched among
themselves and correlated to the factory's existing Surfscan
SP2 and SP2XP baselines, to enhance fleet flexibility and
factory productivity and to maintain high performance and
productivity, the Surfscan SP3 tools are backed by KLA-Tencor's
global, comprehensive service network.
KLA Tencor has already shipped Surfscan SP3 systems to
leading substrate and chip manufacturers in Asia, the United
States and Europe for use in advanced development and production
lines. For more information on KLA-Tencor's unpatterned
wafer defect inspection systems visit the product web pages
at:
http://www.kla-tencor.com/front-end-defect-inspection/surfscan-series.html.
