2.5 x 2.5mm measuring micro plastic BGA packaged mobile FPGA chips for mobile apps

SiliconBlue Technologies has made available functioning samples of the new iCE40 "Los Angeles" mobileFPGA family including the LP-Series (Low-Power) and the HX-Series (High-Speed) families targeting smartphones and tablets, respectively. Fabricated on TSMC 40-nm low-power standard CMOS process, the new LP and HX families provide twice the logic capacity of previous 65-nm devices, says SiliconBlue.

2.5 x 2.5mm measuring micro plastic BGA packaged chip, the Los Angeles LP-Series CMD is suggested as ideal application processor companion chip solution for smartphone applications providing support for sensor management, high-speed custom connectivity and convergence of HD video and imaging. The LP and HX devices range from 640 to 16K Logic Cells.

"We've proven our technology leadership with iCE65 and are on track to ship approximately ten million units this year. We are proud to announce we've taken the next bold step with Los Angeles CMDs by extending our video performance capability for smartphones to 525 Mbps, enabling HD720p 60Hz (1280 x 720) and HD1080p 30Hz (1920 x 1080)," said Kapil Shankar, CEO of SiliconBlue. "For tablets, CMDs can now support WUXGA (1920x1200) with dual LVDS, HD720p 60Hz (1280x720) and HD1080p 30Hz (1920x1080). MIPI-DPI/DBI is also supported." Details regarding SiliconBlue's 40 nm-based mobileFPGA Los Angeles are available on www.siliconbluetech.com/LA.

Pricing and Availability:
The iCE40LP8K and iCE40HX8K, 8000 Logic Cell, LP-Series and HX-Series devices are available now. Smallest package devices start at $1.99 USD in high volume. Most members of the Los Angeles mobileFPGA Family are expected to be full production by Q4 2011.