Date: 11th July 2011
2.5 x 2.5mm measuring micro plastic BGA
packaged mobile FPGA chips for mobile apps
SiliconBlue Technologies has made available functioning
samples of the new iCE40 "Los Angeles" mobileFPGA
family including the LP-Series (Low-Power) and the HX-Series
(High-Speed) families targeting smartphones and tablets,
respectively. Fabricated on TSMC 40-nm low-power standard
CMOS process, the new LP and HX families provide twice the
logic capacity of previous 65-nm devices, says SiliconBlue.
2.5 x 2.5mm measuring micro plastic BGA packaged chip,
the Los Angeles LP-Series CMD is suggested as ideal application
processor companion chip solution for smartphone applications
providing support for sensor management, high-speed custom
connectivity and convergence of HD video and imaging. The
LP and HX devices range from 640 to 16K Logic Cells.
"We've proven our technology leadership with iCE65
and are on track to ship approximately ten million units
this year. We are proud to announce we've taken the next
bold step with Los Angeles CMDs by extending our video performance
capability for smartphones to 525 Mbps, enabling HD720p
60Hz (1280 x 720) and HD1080p 30Hz (1920 x 1080),"
said Kapil Shankar, CEO of SiliconBlue. "For tablets,
CMDs can now support WUXGA (1920x1200) with dual LVDS, HD720p
60Hz (1280x720) and HD1080p 30Hz (1920x1080). MIPI-DPI/DBI
is also supported." Details regarding SiliconBlue's
40 nm-based mobileFPGA Los Angeles are available on www.siliconbluetech.com/LA.
Pricing and Availability:
The iCE40LP8K and iCE40HX8K, 8000 Logic Cell, LP-Series
and HX-Series devices are available now. Smallest package
devices start at $1.99 USD in high volume. Most members
of the Los Angeles mobileFPGA Family are expected to be
full production by Q4 2011.
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