Date: 30th Jun 2011
Kilopass expanding its OTP NVM on SMIC's
55 nm logic CMOS process
Kilopass Technology Inc. and Semiconductor Manufacturing
International Corporation have announced the next phase
of their embedded NVM IP partnership. Kilopass is expanding
its one-time programmable (OTP) NVM product offering to
SMIC's 55 nanometer (nm) logic CMOS process. Kilopass has
already successfully taped out in SMIC's 65nm process.
In partnership since 2005, Kilopass and SMIC began with
the development of Kilopass OTP NVM on SMIC's 180nm and
proceeded on with SMIC's 130nm and 90nm logic CMOS processes.
The collaboration expanded to include 65nm and now continues
with the addition of the 55nm node.
SMIC customers with applications requiring embedded NVM
for storing mixed signal trim data, boot code, and security
key for multimedia processors, MCUs, and RFID ICs, have
benefitted from having Kilopass' secure, embedded, OTP,
NVM solution for their system on chip (SoC) designs.
"We are thrilled that SMIC has expanded our partnership
commitment to include Kilopass OTP NVM IP on its 55nm process
node," said Kilopass President and CEO, Charlie Cheng.
"For SoC designs in competitive, high-volume consumer
applications moving a design from 65nm to 55nm provides
a 20 percent reduction in silicon area and cost without
the expense of a new mask set. This savings provides an
effective means of maintaining profit margins as shipment
volumes and competitive pressure rise."
"We are excited to be expanding our partnership with
Kilopass on our advanced 55nm LL process technology,"
said Chris Chi, senior vice president and chief business
officer of SMIC. "SMIC takes pride in its ability to
deliver to customers cutting-edge 55nm technology process
and IP solutions. Kilopass success taping out their OTP
NVM IP on our 65nm logic CMOS process nodes validates SMIC's
leadership position as an advanced technology provider,
and demonstrates SMIC's commitment to bringing our customers
world-class solutions with the highest reliability, stability
and cost-effectiveness."
|