AMD launches 2 new G-series APUs for Fanless Embedded Systems

AMD has announced immediate availability of two new AMD Embedded G-Series APUs (Accelerated Processing Units) with thermal design power (TDP) ratings of 5.5 and 6.4 watts. AMD says these new APUs offer 39 percent power savings compared to earlier versions1. The 361mm² measuring package is suggested for compact, fanless embedded systems like digital signage, kiosks, mobile industrial devices and many of the new emerging industry-standard small form factors such as Qseven. AMD says this is an unprecedented low-power offering for the embedded market that features one or two low-power x86 "Bobcat" CPU cores and a discreet class DirectX 11-capable GPU on a single die.

"We have seen many of our embedded customers deploy fanless systems even with our 15W TDP processors in the past. Today we take the ground-breaking AMD Fusion APU well below 7W TDP and shatter the accepted traditional threshold for across-the-board fanless enablement," said Buddy Broeker, director, Embedded Solutions, AMD. "System designers can now unleash their creativity without being constrained by heat or size issues."

AMD has designed these processors for Embedded System, which needs to work without a cooling fan for the CPU, where the presence of a fan represents a potential failure point for the system.

Systems based on the new low power AMD Embedded G-Series platform include an industrial mobile device from Amtek, a Pico-ITX single board computer from Axiomtek, a Qseven form factor computer-on-module from datakamp, and a fanless digital signage platform from iBASE.