Memory
Marvell Launches Six-Channel Structera X CXL 3.2 Memory Expanders for AI Inference
Marvell has announced the second-generation Structera X 3406 (MV-SLX34061) and Structera X 3506 (MV-SLX35061), six-channel CXL 3.2 memory expanders designed to address memory demands in AI inference workloads. The Structera X 3406 supports DDR4, while the Structera X
3 min read
SK hynix Presents CXL Memory-Centric AI Rack Systems at OCP Global Summit 2026
SK hynix presented next-generation memory solutions for AI infrastructure at OCP Global Summit 2026, including a 256GB CMM-DDR5 module based on CXL 3.2. The event took place October 12-15 in San Jose, California. The company said th
4 min read
Marvell Unveils Structera X 3406 and 3506 CXL 3.2 Memory Expanders for AI Inference
Marvell Technology, Inc. has announced the second-generation Marvell Structera X 3406 and Marvell Structera X 3506 CXL 3.2 memory expanders for AI inference, with six DDR4/DDR5 channels and PCIe Gen 6 connectivity. The controllers are designed to help cloud, enterpris
3 min read
MaxLinear Puma 9 accelerates AI-ready DOCSIS 4.0/3.1+ multigigabit services, cuts deployment costs
MaxLinear has announced Puma 9, a next-generation DOCSIS platform designed to help broadband operators speed up the rollout of D4.0/D3.1+ multi-gigabit services, power Edge AI, personal AI and Wi-Fi 8 connectivity, and cut the cost and complexity of moving to DOCSIS
7 min read
Renesas Introduces Smallest Configurable GreenPAK IC with Multi-Time Programmability in WLCSP and STQFN Packages
Renesas Electronics Corporation has announced the SLG46801, which it describes as the industry's smallest GreenPAK configurable mixed-signal device offered in both WLCSP and STQFN packages. The 9-ball WLCSP measures just 1.155 mm × 1.155 mm and pairs an ultra-sm
4 min read
Netlist Files New ITC Action Against Micron Technology Over HBM Patents for AI Computing
Netlist has initiated new legal proceedings before the United States International Trade Commission (ITC). The company is seeking exclusion and cease and desist orders against Micron Technology, Inc. and downstream customers Nvidia, Broadcom, and Google, referred to collectively as the Respondent
2 min read
Everspin Demonstrates World's First CXL-Connected MRAM Platform at SNIA 2026
Everspin Technologies has successfully demonstrated what it describes as the world's first Compute Express Link (CXL)-connected MRAM platform at the SNIA Developer Conference 2026, and the system is now ready for customers to test with their own workloads.The
4 min read
NOR Flash price trends in 2H26 show high-capacity products set for 90-110% increases, TrendForce reports
TrendForce's latest memory industry research indicates that the NOR flash market is undergoing its most significant structural shift in supply and demand in nearly a decade. AI-related products are absorbing a substantial share of production capacity, leaving supplier
5 min read
SK hynix invests over $4 billion in HBM advanced packaging facility in Indiana
SK hynix held a groundbreaking ceremony for an advanced packaging production facility for AI memory on the 27th (local time) at the Holloway Gymnasium, Purdue University, in West Lafayette, Indiana. Advanced Packaging is defined as an advanced semiconductor back-end technology that c
5 min read
GlobalFoundries and RAAAM develop next-gen GCRAM technology test chip on FDX platform
GlobalFoundries and RAAAM Memory Technologies today announced a strategic collaboration to develop and qualify Gain-Cell RAM (GCRAM) technology. The partnership has reached a major milestone with the successful tape-out of a GCRAM test vehicle on GF’s FDX FD-SOI platform. The collabo
4 min read
XCENA MX1 architecture integrates memory expansion and near-memory computing
XCENA presented the architecture and measured performance of MX1, its computational CXL memory system, during the Memory session at Hot Chips 2026. The presentation, led by Harry Kim, XCENA's chief product officer, was selected through the Hot Chips program committee's technical review process, a
6 min read
Micron Announces $10 Billion U.S. Research Labs Investment Focused on Memory and AI Technologies
Micron Technology unveiled Micron Research Labs, a U.S.-based research institution headquartered in Boise and backed by a planned $10 billion investment over the next decade. The hub will bring together customers, academia, government and the broader semiconductor ecosystem. Key research areas in
9 min read
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