Memory
NOR Flash price trends in 2H26 show high-capacity products set for 90-110% increases, TrendForce reports
TrendForce's latest memory industry research indicates that the NOR flash market is undergoing its most significant structural shift in supply and demand in nearly a decade. AI-related products are absorbing a substantial share of production capacity, leaving supplier
5 min read
SK hynix invests over $4 billion in HBM advanced packaging facility in Indiana
SK hynix held a groundbreaking ceremony for an advanced packaging production facility for AI memory on the 27th (local time) at the Holloway Gymnasium, Purdue University, in West Lafayette, Indiana. Advanced Packaging is defined as an advanced semiconductor back-end technology that c
5 min read
GlobalFoundries and RAAAM develop next-gen GCRAM technology test chip on FDX platform
GlobalFoundries and RAAAM Memory Technologies today announced a strategic collaboration to develop and qualify Gain-Cell RAM (GCRAM) technology. The partnership has reached a major milestone with the successful tape-out of a GCRAM test vehicle on GF’s FDX FD-SOI platform. The collabo
4 min read
XCENA MX1 architecture integrates memory expansion and near-memory computing
XCENA presented the architecture and measured performance of MX1, its computational CXL memory system, during the Memory session at Hot Chips 2026. The presentation, led by Harry Kim, XCENA's chief product officer, was selected through the Hot Chips program committee's technical review process, a
6 min read
Micron Announces $10 Billion U.S. Research Labs Investment Focused on Memory and AI Technologies
Micron Technology unveiled Micron Research Labs, a U.S.-based research institution headquartered in Boise and backed by a planned $10 billion investment over the next decade. The hub will bring together customers, academia, government and the broader semiconductor ecosystem. Key research areas in
9 min read
Infinity's AI chips become inference-ready in days with Agentic tools
Infinity, an early-stage AI infrastructure research company building the software layer that helps AI chips run inference, has released a new case study showcasing its autonomous research and tool-building agent, Ignition. The agent generates, tests, and optimizes t
6 min read
Kioxia and Sandisk Unveil New 9th-Generation QLC Flash Memory for AI Applications
Kioxia and Sandisk have unveiled a new 9th-generation, high-performance 2Tb QLC 3D flash memory technology, designed to support the growing storage needs of AI-driven infrastructure. QLC, short for quad-level cell, is a type of flash memory that stores more data per
4 min read
Everspin Technologies names Vikas Choudhary to Board of Directors
Everspin Technologies, a developer and manufacturer of MRAM persistent memory technology, has appointed Vikas Choudhary to its board of directors, effective August 10, 2026. Choud
3 min read
Altera expands DDR5 memory support for Agilex FPGA lineup
Altera has expanded DDR5 memory support across its Agilex line of field-programmable gate arrays (FPGAs), chips that can be reconfigured for different tasks after manufacturing, with the release of its Quartus Prime Pro Edition software, version 26.1.1. The update a
4 min read
Winbond July Revenue Jumps 292% YoY, Fueling Capacity Expansion Ahead of 2027 Semiconductor Memory Crunch
Winbond Electronics just posted one of the sharpest revenue swings in the Taiwanese chip sector this year. The Hsinchu-based memory and microcontroller maker reported unaudited consolidated revenue of NT$26.773 billion for July 2026 — up 29.99 percent from June and a striking 291.55 percent
3 min read
XCENA MX1 production lineup launched for hyperscale AI infrastructure
XCENA, a company focused on memory-centric computing for AI infrastructure, has introduced MX1, its new production memory lineup designed to address the capacity, utilization, and data-movement bottlenecks increasingly limiting AI inference at scale. The company is showcasing MX1 at the Future
6 min read
Sandisk and SK hynix release first OCP technical specification for high bandwidth flash standardization
Sandisk and SK hynix have released the technical specification for HBF (High Bandwidth Flash) through the Open Compute Project (OCP), marking a step forward in standardizing the technology for AI inference just six months after the consortium began its work in February.
5 min read
Our Editors dive into topical news, new products, and discuss the shifting architecture of the global semiconductor industry.
▶ Podcast