Automotive
Artery Technology Introduces AT32-USBHS-Adaptor for Embedded Device Connectivity and Debugging
Artery Technology has introduced the AT32-USBHS-Adaptor, a multifunction bridge adapter supporting UART, CAN, SPI, I2C and RS485 for embedded-device connectivity and debugging. During embedded development, devices often use differen
3 min read
NVIDIA Hyperion Supports European L3 and L4 Vehicles, Robotaxis and Freight
NVIDIA says European automakers and mobility providers are showcasing autonomous-mobility use cases on NVIDIA Hyperion, a computing platform for L3 and L4 vehicles and future robotaxi fleets. Volvo Cars is also adopting Hyperion and NVIDIA Alpamayo Stack software for
3 min read
TDK Introduces B3201*A5/B5/C5 Y1 Safety Capacitors for 500 V AC Automotive and Industrial Applications
TDK Corporation has introduced the compact B3201*A5/B5/C5 series of Y1 safety capacitors for EMI suppression in automotive and industrial applications, rated for 500 V AC and up to 1500 V DC. The capacitors have a maximum operating temperature of +125 °C with dera
3 min read
Accellera Approves Functional Safety Language Standard 1.0 for Safety-Critical Systems
Accellera Systems Initiative (Accellera) has approved Functional Safety Language (FSL) Standard 1.0 for release, a language and data model for representing, exchanging and integrating functional safety information across the electronic systems development lifecycle.</
3 min read
AVL, VisIC Integrate High-Power GaN Traction Inverter in Vehicle Demonstrator
VisIC Technologies and AVL are advancing their collaboration with the integration of VisIC's D³GaN power module technology into AVL's vehicle demonstrator. The demonstrator vehicle showcases VisIC D³GaN power modules in an advanced AVL electric drivetrain, taking high-power GaN from tes
7 min read
Foxconn and Mitsubishi Electric Finalize Automotive Equipment Alliance
Hon Hai Precision Industry (Foxconn) and Mitsubishi Electric have reached a final agreement on a strategic alliance for the joint operation of the automotive equipment business. The announcement was published Oct 16, 2026. Lin Yin International Investment Co.,
4 min read
GlobalFoundries Selected to Operate Two New Semiconductor Fabs in New York
GlobalFoundries has been selected to operate two new semiconductor fabs at its Malta, New York, site under a U.S.-Japan initiative providing up to $21 billion in funding. The first fab will be a 300mm facility expected to come online in 2029.
3 min read
Littelfuse Launches TP7.0SMD-XC Automotive TVS Diodes With 24 V Clamping
Littelfuse, Inc. has launched its TP7.0SMD-XC Series automotive-grade transient voltage suppression (TVS) diodes, led by the TP7.0SMD24CA-XC, for protecting sensitive automotive ICs. The series delivers up to 7000 W of peak pulse power in a compact surface-mount packa
3 min read
Vishay Introduces VCND2040X02 and VCND2045X02 Optical Sensors for Battery Data Links
Vishay Intertechnology, Inc. has introduced four Automotive Grade optical sensors—the Vishay Semiconductors VCND2040X02, VCND2040SLX02, VCND2045X02 and VCND2045SLX02—for wear-free optical data communication at up to 6 Mbit/s. The sensors combine an infrared (IR) emitt
2 min read
QuickLogic Secures Six-Figure eFPGA IP Contract for Automotive and Industrial SoC
QuickLogic Corporation has announced an eFPGA Hard IP design win for a programmable system-on-chip (SoC) targeting battery management, precision motor control and industrial robotic applications on 16nm automotive process technology. The initial contract is valued at
3 min read
Valeo and KE:SAI Launch Open-Source Initiative for Generalist Autonomous Driving Systems
Valeo and KE:SAI (Kyutai ELLIS Scalable Autonomous Intelligence) will develop a generalist AI driving system for autonomous vehicles. The open-science research collaboration aims to make the system fully reproducible and release its code, trained models and datasets a
3 min read
GlobalFoundries Marks Dresden Expansion Milestone, Announces FDX Fusion for Physical AI
GlobalFoundries has announced FDX Fusion, a next-generation platform for highly integrated, energy-efficient chips designed for demanding Physical AI applications and planned for development and manufacturing in Dresden. The announcement accompanied the topping-out of
3 min read
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