Some of the latest achievements in semiconductor lithography in 2015
1. Taiwan Semiconductor Manufacturing Company (TSMC) has achieved a milestone in extreme ultraviolet lithography (EUVL) technology by exposing more than 1,000 wafers in 24 hours with sustained power of over 90 Watts.
2. Canon has announcement regarding viability of nanoimprint lithography (NIL) for high-volume semiconductor manufacturing, which is ready now for production of flash memory.
3. imec developed a DSA solution that is compatible with chip manufacture at the 7-nanometer process node.