Taiwan's semiconductor fab status post-earthquake

Recent earthquake in Taiwan on April 3 has not caused any major disruption except a day work delayed with most of the fabs resuming the production back with in half a day after quake. The local industry analyst firm TrendForce reported its assessments on the semiconductor industry's operational status and damage. Here is what it finds: Minimal Initial Damage: The earthquake, with a magnitude of 7.2, mainly affected the DRAM and foundry industries in Taiwan. Fortunately, initial inspections revealed minimal damage to equipment and facilities. Sequential Shutdowns: Manufacturers in affected regions initiated sequential shutdowns for inspections. Despite this, no significant equipment damages were reported. Restoration Efforts: TrendForce is currently assessing damage to production line fragments and furnace tubes. However, they anticipate manufacturers restoring production capacities swiftly with minimal impact on supply. Pricing Suspensions: Major players like Micron, Samsung, and SK hynix suspended DRAM pricing temporarily, reflecting a cautious approach amidst uncertainties post-earthquake. Spot Market Stability: Despite shutdowns and inspections, the spot market for DRAM and NAND Flash memory remained stable, with minimal price fluctuations. Short-term Price Increase: TrendForce predicts a slight short-term increase in DRAM spot prices due to cautious market ...