Marvell showcased its 200 Gbps-per-lane electrical I/O at the 2023 OCP Global Summit
Date: 19/10/2023
Marvell Technology showcasing its cutting-edge PAM4 DSP technology, which enables a remarkable 200 Gbps per lane transmission over electrical channels, at booth B13 at the ongoing OCP Global Summit.
Marvell said it is going to play a pivotal role in the development of 200G/lane active electrical cables (AEC) with an eye to establish a solid base for the advancement of next-generation AI clusters and cloud infrastructure.
This live demonstration will highlight the exceptional capabilities of Marvell's 224G long-reach SerDes technology, capable of driving 40dB+ of insertion loss at 224G per lane. Additionally, Microsoft, located at booth B7, will be conducting a similar technology demonstration specifically tailored for a copper-channel use case that aligns with Microsoft's requirements.
Marvell's high-speed SerDes technology is a crucial part of their data infrastructure platform. This platform includes encryption engines, chip-to-chip connections,system-on-chip fabrics, and physical interfaces. It is used to design semiconductors, processor subsystems and chiplets for various use cases, customers and applications. Marvell's 5nm 224G 40db+ long-reach SerDes technology allows for the development of components with 200G electrical I/O, which is necessary to meet the requirements of future cloud infrastructure.
“Marvell is continuing its SerDes leadership in 200G and is addressing the accelerating bandwidth requirements of AI and other complex workloads,” said Achyut Shah, senior vice president and GM, Connectivity Business Unit, at Marvell. "We are pleased to be demonstrating our leading offerings at OCP and for the technology to be showcased in Microsoft’s booth.”
A SerDes, also known as a serializer/deserializer, is an essential component utilized in the development of integrated circuits for facilitating high-speed communications. Its primary function involves converting data from parallel interfaces, such as the input/output of a switch ASIC, into a serial interface. This conversion enables the seamless exchange of data between various devices via copper or fiber connections. It is worth noting that different SerDes blocks are specifically optimized for varying distances. For instance, long-reach SerDes is employed to establish connections over physical interconnects between systems spanning several meters, while short-reach or extra-short-reach SerDes is utilized to interconnect die within a system-on-a-chip.
Marvell integrates its SerDes technology, in conjunction with interconnect technologies, into its leading silicon solutions, encompassing Teralynx switches, PAM4 and coherent DSPs, Alaska Active Electrical Cable (AEC) retimers and Ethernet physical layer (PHY) devices, OCTEON processors, Bravera storage controllers, Brightlane automotive Ethernet chipsets, and custom ASICs.
The 2023 OCP Global Summit is taking place October 17-19 at the San Jose Convention Center.
For more information visit:https://www.marvell.com/
