High Bandwidth Memory market's dominant product for 2023 is HBM2e

TrendForce reports that the HBM (High Bandwidth Memory) market's dominant product for 2023 is HBM2e, employed by the NVIDIA A100/A800, AMD MI200, and most CSPs' (Cloud Service Providers) self-developed accelerator chips. As the demand for AI accelerator chips evolves, manufacturers plan to introduce new HBM3e products in 2024, with HBM3 and HBM3e expected to become mainstream in the market next year. The distinctions between HBM generations primarily lie in their speed. The industry experienced a proliferation of confusing names when transitioning to the HBM3 generation. TrendForce clarifies that the so-called HBM3 in the current market should be subdivided into two categories based on speed. One category includes HBM3 running at speeds between 5.6 to 6.4 Gbps, while the other features the 8 Gbps HBM3e, which also goes by several names including HBM3P, HBM3A, HBM3+, and HBM3 Gen2. The development status of HBM by the three major manufacturers, SK hynix, Samsung, and Micron, varies. SK hynix and Samsung began their efforts with HBM3, which is used in NVIDIA's H100/H800 and AMD's MI300 series products. These two manufacturers are also expected to sample HBM3e in Q1 2024. Meanwhile, Micron chose to skip HBM3 and directly develop HBM3e. HBM3e will be stacked with 24Gb mono dies, and under the 8-layer (8Hi) foundation, the capacity of a single HBM3e will jump to 24GB. This...