JEDEC updates JEP30, electronics component part data exchange guidelines
Date: 25/05/2023
JEDEC Solid State Technology Association announced significant updates to the JEP30 PartModel Guidelines, including all reference documents and related XML Schema files. JEP30 and its constituent documents are available for free download from the JEDEC website (https://www.jedec.org/category/technology-focus-area/jep30).
JEP30 establishes requirements for the frictionless digital exchange of part data between part manufacturers and their end customers responsible for electrical and electronic products creation. The JEP30 guidelines define a standardized format that can be efficiently consumed across different CAD tools and environments. By defining a common framework for part model creation and verification and helping to ensure different tools can accurately interpret and utilize the models created by the full spectrum of part manufacturers, JEP30 offers a transformative resource for both component manufacturers and designers.
The updated JEP30 part model guidelines can be used to define the digital twin of a part with the detail to enable significant process efficiencies throughout the part and product life cycles, including design, manufacturing, quality control, test, material declaration, and supply chain.
JEP30 and its related documents are currently published and maintained as a JEDEC-wide project between the JC-11, JC-14, JC-15 and JC-16 Committees. JEP30 establishes the requirements for exchanging part data between part (mainly electronics and semiconductor components) manufacturers and their customers for electrical and electronic products. As one example, the standard could be used to define a part in sufficient detail to enable process efficiencies during the part and product life cycles, i.e., design, purchasing, manufacturing, quality control, test, material deceleration, supply chain, etc.
News Source: JEDEC
