JEDEC to bring standards on stackable DDR5 CAMM Memory modules

Date: 04/05/2023
To increase the number of DDR5 memory channels per CAMM memory module electronics device manufacturing standard body JEDEC is updating its CAMM standards to include stackable CAMMs and also support LPDDR5 DRAM chips.

JEDEC Solid State Technology Association stated in its release that "The first expansion adds support for stackable CAMMs. These are called dual-channel (DC) and single-channel (SC) CAMMs, respectively. By splitting the dual-channel CAMM connector lengthwise into two single-channel CAMM connectors, each connector half can elevate the CAMM to a different level. The original CAMM supports two DDR5 memory channels in one connector, while the stackable CAMMs support one DDR5 memory channel per connector."

The release further explains:

"Two SC connectors can reside on the same motherboard in place of one DC connector, allowing many system configuration options. Stackable CAMMs save space in the X,Y directions while increasing space in the Z direction, which is essential for desktop and performance notebook applications."

The form factor and pinout is also optimized for LPDDR5 wher DDR5 and LPDDR5 is supported in the same CAMM Common Standard, and supported by the same connector design. This saves the computing motherboard manufacturer from soldering LPDDR5 chips directly to the board and instead go for modular attachment.

“These expansions assure that the CAMM standard meets needs of all use cases and can scale well into the future,” said Mian Quddus, JEDEC’s Board of Directors Chairman. “There is great interest in broadening use of LPDDR5 in notebooks and modularity is a key customer value.” From Tom Schnell, JEDEC’s CAMM Task Group Chairman, “The CAMM Common Standard will include DDR5 and LPDDR5 within the same documents to assure consistency and they will be released together later this year. New designs will have more modularity choices than ever before.”