Intel semiconductor tiles era: Chiplets to constitute 1-trillion transistors sys-in-pack

At the IEEE hotchips event, Intel's CEO Pat Gelsinger shared to the audience Intel's way of designing 1-trillion transistor integrated circuits on semiconductor for new era of fast-growing AI computing. It can go beyond personal computer and smart phone to Metaverse, blockchain/Bitcoin, edge computing, HPC/AI datacentre, automotive computing for autonomous driving, and many such emerging applications that automate and smart everything. It can be a single tiny low power consuming chiplet for your edge computing, to a lot bigger ultrahigh performance system of chips packing trillions transistors for supercomputing datacenters, and even a unique low-power system of chips for AR/VR kind of applications powering metaverse. Chiplet based system in package is becoming better option than monolithic chips. The new advances in chip packaging is driving this trend. The market opportunities to expand for such heterogeneous semiconductor chips. Customization of silicon is also a driver of this market. Gamer processor can have a set of graphic-processing focused different chiplets compared to notebook processor used by business executive. Below are the other key features, points, facts on Intel's new semiconductor technology roadmap available in the public domain and shared by Intel's own executives including what Pat Gelsinger said at hotchips: 1. This highly scalable ...