Large FDSOI fab to come up at Crolles, France jointly by STMicro and GF

FDSOI technology gets a massive push from two big innovators/investors of this technology. STMicroelectronics, a company which has put significant intellectual effort in making this technology a beneficial in terms of performance cost and other factors, is now strengthening its partnership with Globalfoundries in creating a new jointly operated 300 mm chip manufacturing facility at its own presently operating semiconductor manufacturing facilities at Crolles, France. This new factory to produce 620,000 300mm wafer per year when it achieves full capacity by 2026. The fab to serve the customers from Europe and worldwide. The various FDSOI technologies to be used at this fab include FDX technology, and the nodes down to 18 nm covering applications such as automotive IOT and mobile. With the Europe, setting a goal of reaching 20% of worldwide semiconductor production by 2030, This new manufacturing facility supported by state of France, is a major contributor in reaching that goal. FDSOI, compared to other technologies delivers both performance and cost advantage, somewhat in line with Moore's Law. To some of the readers who are less aware of the benefits of FDSOI or other technologies, here reproduced below the earlier interview article published in EE Herald. While the semiconductor fab industry facing big hurdle in scaling further down after 28nm without...