UMC collaborates with APM to strengthen its MEMS service offer

Semiconductor chip foundry United Microelectronics Corporation (UMC) collaborates with Asia Pacific Microsystems (APM) to intensify MEMS service capabilities for its customers. UMC would mutually leverage 8” and 12” production capabilities with APM’s 6” fab and extensive MEMS know-how and prototyping experience. So that the chip designers to provide solution to manufacture flexible and scalable end-to-end MEMS. S.C. Chien, senior vice president of Corporate Marketing division at UMC said, “UMC has been highly successful in producing MEMS products for microphone, accelerometer and environmental sensor applications,”. “Partnering with APM allows us to broaden our MEMS addressable market to serve a wider range of customers targeting the growing Internet-of-Things (IoT) sector, such as system companies, module providers and designers of new MEMS chips. This alliance will also provide customers with greater working model flexibility, as APM can provide full turnkey service, MEMS prototyping and small volume manufacturing, while UMC delivers process porting capability for mainstream, volume production MEMS products that are ready to migrate to more productive and cost effective 8” manufacturing. Moreover, customers can combine their MEMS modules with UMC’s advanced 12” CMOS fab processes to introduce state-of-the-art MEMS features within an ASIC design.” The emerging trend is ...