STATS ChipPAC opens its new 808,000 square feet facility in Singapore

STATS ChipPAC celebrated the grand opening of its new building in Singapore with more than 150 distinguished guests, including Singapore Deputy Prime Minister and Coordinating Minister for National Security & Minister for Home Affairs, Mr. Teo Chee Hean, and other governmental and business representatives. STATS ChipPAC has invested approximately US$1.7 billion (S$2.1 billion) in Singapore to date to expand its technology offerings and manufacturing capacity. Singapore has become the Company’s global hub for advanced wafer level technology research and development (R&D) and wafer level packaging centre of excellence for advanced mobile devices. Based on the increasing market demand for these devices, STATS ChipPAC expects to accelerate its investments in Singapore by a further US$500 million (S$620 million) over the next three years. "Our mobile communications business worldwide has experienced strong, double-digit growth over the past three years and contributed US$1.0 billion (S$1.2 billion) to STATS ChipPAC’s revenue in 2012. Mobile technology convergence is pushing the boundaries for smaller form factor, higher performance, increased functionality and lower cost semiconductors. In 2012, more than 60% of the 2.5 billion chips we manufactured in Singapore went into mobile handsets, smartphones and tablets," said Tan Lay Koon, President and Chief Executive Officer, STA...