CEA Leti: Integrating photonic layer with CMOS circuit is ready for mass production

CEA-Leti has announced successful completion of HELIOS program, for integrating a photonic layer with a CMOS circuit, using microelectronics fabrication processes. With this achievement CEA-Leti says Europe is in a position to make volume production of silicon photonics semiconductor devices. “It is strategically important for Europe to maintain photonic chip-design and chip-integrating functions to compete with other countries and to encourage innovation by European microelectronics companies,” said Leti CEO Laurent Malier. “HELIOS’s success in creating the essential building blocks for integrating photonics with CMOS circuits and making the process available to a variety of users underscores the key role that broad European technological cooperation plays in a very competitive global business environment.” Thomas Skordas, head of the EC’s photonics unit, said HELIOS has shown the large potential silicon photonics has in many different applications, such as data communications. “The technology roadmap of silicon photonics becomes clearer now. Europe will have to move fast to become competitive in this new field,” Skordas said. “Strategies for the industrialization of silicon photonics are currently being discussed in the context of Horizon 2020, the EU's new framework program for research and innovation for 2014-2020." Launched by the European Commission in 2008,...