Date: 24/01/2013

Spreadtrum using STATS ChipPAC’s eWLB packaging equipment

STATS ChipPAC has announced that China based fast growing semiconductor company Spreadtrum Communications has adopted STATS ChipPAC’s packaging innovations for a number of its mobile chipsets.

“China is now the single largest smartphone market in the world and is rapidly growing,” said Brian Chen, Vice President of Operations at Spreadtrum. “By combining our unique chip architecture and leading TD-SCDMA modem technology with STATS ChipPAC’s technology and manufacturing leadership, we have been able to deliver high performance TD-SCDMA chipsets in a package format that continues to provide Spreadtrum and our customers with a clear competitive advantage in the China market.”

“Our extensive collaboration with Spreadtrum demonstrates the transformative advantages of eWLB technology. We have been able to rapidly optimize the overall functional performance of their silicon with an innovative packaging technology designed to optimize speed, performance and size at an overall lower cost of ownership,” said Dr. Han Byung Joon, Executive Vice President and Chief Technology Officer, STATS ChipPAC. “Spreadtrum’s success in China and beyond is evident by the numerous product introductions and global customer wins they have had and we are excited to be working together to drive innovations in the smartphone market.”
Author: Srinivasa Reddy N