Date: 28th Sept 09
TSMC to produce Fujitsu's semiconductor
chips at 28nm process node
Fujitsu Microelectronics and Taiwan Semiconductor Manufacturing
Company (TSMC) have agreed to collaborate on 28-nanometer
(nm) process technology targeted for foundry production
of Fujitsu Microelectronics' 28nm logic ICs and to jointly
develop an enhanced 28nm high-performance process technology
by utilizing TSMC's advanced technology platform. Previously,
both companies announced that Fujitsu Microelectronics will
collaborate with TSMC on 40nm production. This will extend
Fujitsu Microelectronics' 40nm collaboration with TSMC and
covers joint development of an optimized 28nm high-performance
process technology. Initial 28nm samples are expected to
ship toward the end of 2010.
"We are rapidly progressing in our previously-announced
collaboration with TSMC on 40nm process technology, with
several product designs in progress at present", said
Haruyoshi Yagi, Corporate Senior Vice President of Fujitsu
Microelectronics Limited. "With this further agreement
with TSMC on 28nm high-performance process technology development
and production, we combine both companies' strengths to
create greater value for our customers, and will further
drive the growth of businesses for TSMC and Fujitsu's ASIC
and ASSP(1) core products."
"Fujitsu Microelectronics selected TSMC as a partner
based in part on TSMC's unsurpassed record of developing
and ramping advanced technologies. The agreement today is
also a vote of confidence in TSMC's technology platforms
that include design related considerations such as design
kits, design flows, TSMC and 3rd party IP; robust device
related documentation, processes technology excellence and
backend assembly and test capabilities," said Jason
Chen, Vice President, Worldwide Sales and Marketing, TSMC.
|