MICROFAB TS-650 NXG: MacDermid Alpha's Next-Gen Tin-Silver Metallization Process
Date: 12/03/2024
MacDermid Alpha Electronics Solutions unveils MICROFAB TS-650 NXG, the latest advancement in tin-silver bump, pillar, and capping metallization for semiconductor wafer plating. Engineered to address the semiconductor industry's stringent requirements for precision and performance, MICROFAB TS-650 NXG offers enhanced uniformity, reliability, and cost efficiency, reinforcing its role in driving innovation and technological progress.
Enhanced Uniformity: MICROFAB TS-650 NXG is meticulously crafted to deliver unparalleled within-wafer, within-die, and within-feature uniformity, ensuring consistent electrical properties and minimizing defects.
Improved Process Performance: Building upon the success of its predecessor, MICROFAB TS-650 NXG offers enhanced photoresist compatibility, improved coplanarity, and compliance with environmental, health, and safety (EH&S) regulations.
Whiskering Prevention: The tunable tin-silver alloy produced by MICROFAB TS-650 NXG eliminates the risk of whiskering while offering a lower reflow melting point and increased resistance to mechanical stress, ensuring long-term reliability.
Versatile Applications: Designed for a wide range of applications including Flip Chip, FOWLP, 2.5D/3D bumping, C4 Bump, µ Bump, and capping, MICROFAB TS-650 NXG provides higher plating speeds and seamless integration with MacDermid Alpha’s copper pillar plating technologies.
MICROFAB TS-650 NXG empowers semiconductor manufacturers to achieve precision, reliability, and cost efficiency in their operations.
“To meet the growing semiconductor WLP market MacDermid Alpha is continuously developing its innovative WLP solutions driven by the market demand for highly coplanar pillars, higher throughput, and lower cost of ownership”, comments Ashley Kuppersmith, Product Manager – Wafer Level Packaging at MacDermid Alpha. “The improvements provided by MICROFAB TS-650 NXG over the original MICROFAB TS-650 process, including photoresist compatibility, improved coplanarity, and EH&S compliance, make it the solution of choice for excellent solderability of chip or package to a substrate.”
To find out more visit: https://www.macdermidalpha.com/semiconductor-solutions/products/plating-solder/microfab-ts-650-nxg
