Renesas launched new LP Bluetooth LE SoC for locationing and other markets
Date: 22/01/2024
Renesas unveiled its new DA14592, a new Bluetooth LE SoC for power-efficient connectivity in broad range of applications such as connected medical devices to asset tracking and crowd-sourced location tracking.
DA14592 features multi-core architecture (Cortex-M33, Cortex-M0+) and a calculated tradeoffs between on-chip memory and SoC die size. With lowest radio power consumption, it introduces a new low-power mode, offering a remarkable 2.3mA radio transmit current at 0dBm and a only 1.2mA radio receive current. With ultra-low hibernation current of 90nA and active current as low as 34ľA/MHz, the DA14592 ensures extended shelf-life and efficiency for range of applications.
DA14592 need only six external components reducing engineering bill of materials (Ebom). In a small package size (WLCSP: 3.32mm x 2.48mm and FCQFN: 5.1mm x 4.3mm), this device packs high-precision sigma-delta ADC, up to 32 GPIOs, and QSPI support for external memory expansion further enhances its versatility.
Renesas has streamlined integration with the DA14592MOD module, eliminating the need for external components to implement a Bluetooth LE solution. This module ensures the fastest time-to-market and reduced project cost, with emphasis on design flexibility and ease of attachment during development, enhancing overall project efficiency.
One standout application showcased by Renesas is Crowd-Sourced Locationing, aligning with the market's growth projected to reach over US$29 billion in North America alone by 2031. Renesas said DA14592 supports its commitment to offering best-in-class reference designs for crowd-sourced locationing, aligning with emerging trends such as Google's Find My Device network.
