Digital Lithography Tech for large chiplet based sysmoore kind of Heterogenous large substrate packages
Date: 13/12/2023
Leading semiconductor equipment maker Applied Materials in partnership with Ushio has announced what it claims has breakthrough Digital lithography technology to manufacture advanced heterogenous integrated 3-D packages by using multiple chiplets. This equipment is basically made to form submicron patterns on large-sized advanced substrates such as glass. This equipment to help manufacture most advanced AI chips for the new era of AI computing.
Image Source: Applied
With the monolithic scaling becoming tougher and tougher and also very expensive, the semiconductor industry is clearly heading towards heterogenous integrated 3-D packages with already lot of successful products in the market.
There is a boom in the market for such products, to address the growing demand semiconductor manufacturers are looking for highly advanced semiconductor lithography equipment to achieve high resolution and also high throughput so that high-volume demand can be met to serve the very fast growing AI chip market.
The industry is seeing huge demand for AI chips from companies such as nVidia, where the lead time is significantly high. These advanced equipments can help the leading semiconductor fabs to manufacture such chips with high throughput.
The interesting part of this tool is it supports glass as substrate. Glass as substrate offers significant advantage over other traditionally used substrates, where it helps to achieve extremely fine pitch interconnects and delivering superior electrical and mechanical performance. Another feature of this equipment is it supports larger size of substrates which is a trend now in the 3-D semiconductor chip industry.
Applied's partner Japan based Ushio provides specialized steppers for package substrates with its proprietary large-area projection lens technology to achieve high resolution and overlay accuracy required for the latest packaging substrates.
Image Source: Ushio
News Source: Applied Materials
