By joining TSMC 3DFabric Alliance, proteanTecs to provide better on-chip monitoring
Date: 06/10/2023
Israel-based semiconductor chip health monitoring solutions provider proteanTecs announces it has joined TSMC 3DFabric Alliance to support 3D semiconductor fabrication ecosystem. Semiconductor are key parts of safety and security system world over, these devices need to be highly reliable even though they advance in terms of higher monolithic integration as well as three-dimensional chip let based fabrication. To help automate the monitoring of chip's health and performance while designing and manufacturing the chip, proteanTecs offers solutions such as Design analysis at a specific process, Pre-silicon production visibility, Intelligent integration of Agents, Actionable insights and alerts in production and in-field, Machine learning of design analysis and Agent Readouts and On-demand cloud-based data analytics and visualization.
proteanTecs simulation engines perform extensive analysis of Frequency and Power across hundreds of process points, voltages and temperatures.
TSMC Open Innovation Platform (OIP) 3DFabric Alliance was formed to encourage 3D integrated circuit (IC) innovation, readiness and customer adoption when using TSMC’s 3DFabric, a comprehensive family of 3D silicon stacking and advanced packaging technologies.
Application of these technologies is becoming essential for 3-D chips. 3-D chips is better option over monolithic scaling to achieve the typical PPA (power, performance, area) and functionality at less cost for today's cutting-edge applications such as AI processors used in advanced gadgets such as AR/VR, automotive and cloud computing.
proteanTecs said it will have early access to TSMC technology to better serve mutual customers and streamline their complex 3D IC design processes. Multiple customers have successfully implemented proteanTecs’ on-chip monitoring technology into their chips, manufactured using TSMC’s N7, N5 and N3 processes with the TSMC 3DFabric technologies including CoWoS and InFO advanced packaging platforms.
“We’re pleased to have proteanTecs join our 3DFabric Alliance and will work closely with them to offer our mutual customers an easy and flexible way to unlock the power of 3D IC in their designs,” said Dan Kochpatcharin, head of the Design Infrastructure Management Division at TSMC. “Through the collective leadership of TSMC and our design ecosystem partners, our 3DFabric Alliance will help customers reach an entirely new level of performance and power efficiency required for the next-generation AI, HPC, and mobile applications.”
“The 3DFabric Alliance demonstrates TSMC’s keen awareness of the direction in which the semiconductor industry is evolving,” said Nir Sever, Senior Director of Business Development at proteanTecs. “proteanTecs is pleased to collaborate within the 3DFabric Alliance to accelerate the adoption of 3D heterogenous systems. As the chiplet ecosystem grows, we will continue to support the industry with monitoring solutions that elevate reliability and quality standards and give companies the confidence to scale.”
proteanTecs also recently announced that their die-to-die interconnect monitoring IP passed the pre-silicon IP assessment in the TSMC9000 quality program.
In another announcement proteanTecs said it is partnering with ELES to enhance reliability testing with deep data analytics. ELES designs and manufactures semiconductor test solutions for SoC, Power, MEMS and memories with the leading semiconductor companies as customers.
The proteanTecs and ELES collaboration enables an innovative approach that adds parametric measurements during the stress test in order to accurately and precisely monitor the real degradation effects. Additional applications include smart selection of the test material, dynamic stress level calibration to match the required mission profile, early identification of outliers, and the ability to quickly root cause once a failure is observed.
“Our strategic cooperation with proteanTecs enhances our Design for Reliability Test (DfRT) process, by enabling a smarter, more effective qualification flow that addresses the increasing performance and reliability needs of advanced electronics,” said Antonio Zaffarami, President of ELES. “ELES’ Reliability Embedded Test Engineering (RETE) methodologies—empowered by proteanTecs deep data analytics—allows our clients to identify and remove device weaknesses and to manufacture more reliable devices, achieving higher production yields and shortening their time to market. Enter the era of manufacturing with zero scraps!”
“It is privilege to partner with ELES, a recognized leader in semiconductor reliability solutions, to enhance and innovate the device qualification and test domains for our joint customers,” said Uzi Baruch, Chief Strategy Officer (CSO) at proteanTecs. “By providing parametric visibility based on chip telemetry, we offer Quality and Reliability engineers increased confidence, enabling both novel measurement techniques and predictability in reliability testing. Together, we look forward to taking the industry one step further towards seamless visibility.”
Source: proteanTecs
