By joining TSMC 3DFabric Alliance, proteanTecs to provide better on-chip monitoring

Israel-based semiconductor chip health monitoring solutions provider proteanTecs announces it has joined TSMC 3DFabric Alliance to support 3D semiconductor fabrication ecosystem. Semiconductor are key parts of safety and security system world over, these devices need to be highly reliable even though they advance in terms of higher monolithic integration as well as three-dimensional chip let based fabrication. To help automate the monitoring of chip's health and performance while designing and manufacturing the chip, proteanTecs offers solutions such as Design analysis at a specific process, Pre-silicon production visibility, Intelligent integration of Agents, Actionable insights and alerts in production and in-field, Machine learning of design analysis and Agent Readouts and On-demand cloud-based data analytics and visualization. proteanTecs simulation engines perform extensive analysis of Frequency and Power across hundreds of process points, voltages and temperatures. TSMC Open Innovation Platform (OIP) 3DFabric Alliance was formed to encourage 3D integrated circuit (IC) innovation, readiness and customer adoption when using TSMC’s 3DFabric, a comprehensive family of 3D silicon stacking and advanced packaging technologies. Application of these technologies is becoming essential for 3-D chips. 3-D chips is better option over monolithic scaling to achieve ...