PAM-4 DSP PHY 5 nm chip offers 200G/lane serial optical interfaces

High speed communication semiconductor expert Broadcom launched its new 5nm 200G/lane optical PAM-4 DSP PHY, the Sian BCM85822 delivering 200G/lane serial optical interfaces. It has announced this at the 49th European Conference on Optical Communication (ECOC 2023). Broadcom demonstrating its BCM85822 and 200G EML operating inside Eoptolink 1.6T DR8, 1.6T 2xFR4 and 800G DR4 optical modules at Eoptolink Booth 432 at the ECOC 2023 exhibition in Glasgow, Scotland from October 2nd to 4th. Broadcom said the BCM85822 allows optical transceiver manufacturers to cost effectively deliver 800G and 1.6T pluggable modules and meet the growing bandwidth needs and low power consumption requirements of hyperscale data centers. Further details shared by Broadcom in its release: Sian BCM85822 Product Highlights Monolithic 5nm 800G (8:4) PAM-4 DSP with integrated laser driver Delivers best-in-class module performance in BER and power consumption Proven interoperability with Broadcom’s 200G EML Compliant to all IEEE and OIF standards, capable of supporting MR links on the chip to module electrical interface Supports optical modules from 800G to 1.6T Supports IEEE compliant (128,120) Hamming Inner Code Given the increasing bandwidth demands from AI-driven workloads in hyperscale data centers, deploying 1.6T OSFP-XD transceiver modules would double the bandw...