PAM-4 DSP PHY 5 nm chip offers 200G/lane serial optical interfaces
Date: 02/10/2023
High speed communication semiconductor expert Broadcom launched its new 5nm 200G/lane optical PAM-4 DSP PHY, the Sian BCM85822 delivering 200G/lane serial optical interfaces. It has announced this at the 49th European Conference on Optical Communication (ECOC 2023). Broadcom demonstrating its BCM85822 and 200G EML operating inside Eoptolink 1.6T DR8, 1.6T 2xFR4 and 800G DR4 optical modules at Eoptolink Booth 432 at the ECOC 2023 exhibition in Glasgow, Scotland from October 2nd to 4th. Broadcom said the BCM85822 allows optical transceiver manufacturers to cost effectively deliver 800G and 1.6T pluggable modules and meet the growing bandwidth needs and low power consumption requirements of hyperscale data centers.
Further details shared by Broadcom in its release:
Sian BCM85822 Product Highlights
Monolithic 5nm 800G (8:4) PAM-4 DSP with integrated laser driver
Delivers best-in-class module performance in BER and power consumption
Proven interoperability with Broadcom’s 200G EML
Compliant to all IEEE and OIF standards, capable of supporting MR links on the chip to module electrical interface
Supports optical modules from 800G to 1.6T
Supports IEEE compliant (128,120) Hamming Inner Code
Given the increasing bandwidth demands from AI-driven workloads in hyperscale data centers, deploying 1.6T OSFP-XD transceiver modules would double the bandwidth capacity per 1RU without changing the existing infrastructure. The BCM85822 is optimized for the 1.6T OSFP-XD transceiver module design and would effectively enable 51.2T switching capacity in a 1RU rack to improve bandwidth density in hyperscale data centers. Further, the adoption of 200G/lane optical interfaces lays the foundation for the eventual deployment of 1.6T and 3.2T solutions with 200G/lane electrical interfaces, which are needed for cloud providers to support next generation switches and scale AI workloads.
“This latest generation of DSP operating at 200G/lane extends Broadcom’s leadership in high-bandwidth PHY and enables the lowest power optical modules in the industry,” said Vijay Janapaty, vice president and general manager of the Physical Layer Products Division at Broadcom. “This, in turn, lays the foundation for next generation switching platforms for AI/ML clusters and networks.”
For more information on how Broadcom’s 200G/lane optical solutions drive next-generation networks, visit: https://www.broadcom.com/blog/200g-lane-optical-solutions-drive-next-generation-networks
Availability
Broadcom is currently sampling both the BCM85821 and BCM85822 to its early access customers and partners. The BCM85821 is an 800G (8:4) PAM-4 DSP PHY with no integrated laser driver.
Further information on the BCM85821 and BCM85822 can be found online at:
https://www.broadcom.com/products/ethernet-connectivity/phy-and-poe/optical/bcm85821
https://www.broadcom.com/products/ethernet-connectivity/phy-and-poe/optical/bcm85822
News Source: www.broadcom.com
