ams announce Multi-Project Wafer schedule for 2017

ams scheduled its multi-project wafer (MPW) or shuttle run for 2017. The chip prototyping service offered by ams basically combines several IC’s designed from different customers in a single wafer. ams is offering this MPW service in the range of 180nm and 0.35µm. It also includes recently introduced 180nm CMOS technology (“aC18”). The aC18 process supports a large number of 1.8V and 5.0V NMOS and PMOS devices (substrate based, floating, low leakage and high threshold voltage options) and fully characterized passives including various capacitors. Area-optimized high-density and low-power digital libraries with gate densities up to 152kGates/mm², updated digital and analog I/O libraries with up to 6 metal layers as well as ESD protection cells with up to 8kV HBM level complete the offering. ams says its aC18 process targets sensor and sensor interface devices in a range of applications. All 2017 MPW runs in aC18 technology is going to be manufactured in ams’ state of the art 200mm fabrication facility in Austria where ams assures very low defect densities and high yields. Addition to this, another four aC18 MPW will also offer four MPW runs in its advanced 180nm High-Voltage CMOS (aH18) technology supporting 1.8V, 5V, 20V and 50V devices. Ams also announced for its 0.35µm specialty processes a total of 14 runs are offered in 2017. ams' 0.35µm High-Voltage CMOS process opti...