Cypress' PSoC 4 and PRoC BLE chips in micro-ball CSP package and industrial temp

PSoC 4 BLE Programmable System-on-Chip and PRoC BLE Programmable Radio-on-Chip solutions from Cypress Semiconductor are now available in micro-ball Chip Scale Package (CSP), which can be used in secure credit card applications where Bluetooth Smart connectivity is required. 0.38-mm thick devices are suggested as replacement for chip-on-board devices. These devices are also available with extended industrial temperature range option with operation from -40ºC to +105ºC for applications such as industrial, automotive and lighting. The micro-ball CSP package as well as extended industrial temperature options are available for the 128KB and 256KB flash versions of the PSoC 4 BLE and PRoC BLE solutions. The new offerings are pin-to-pin compatible with Cypress’s original Bluetooth Low Energy solutions, simplifying upgrades. “Bluetooth Low Energy is quickly expanding its market reach and Cypress is continually innovating to address requirements for a diverse set of emerging applications,” said Eran Sandhaus, Vice President, Wireless Product Family at Cypress. “These new CSP and temperature options bring the ease-of-use, programmability and robust, low-power performance of our PSoC 4 BLE and PRoC BLE solutions to an even broader range of customers.” Cypress' customizable Bluetooth Low Energy solutions suggested for IoT applications, home automation, wireless Human Interface Dev...