Latest version of semiconductor virtual fabrication software

Are you facing some limitations in your Virtual semiconductor fabrication software SEMulator3D from Coventor to take your Virtual fabrication further closer to real fabrication. The new version SEMulator3D 5.0 supports new process capabilities and is re-architected for a more streamlined learning, deployment and modeling process.

SEMulator3D version 5 supports process modeling for FinFETs, 3D NAND Flash, BEOL, Nanowires, 3D-IC, FDSOI, DRAM, and other next generation chip manufacturing processes at deeper nodes such as 16nm, 14 nm and 10 nm. The various other improvements in the latest version includes:

1. New and advanced capabilities for handling dopants, including new process models for ion implant, thermal diffusion and in-situ doped deposition and epitaxy.
2. Dopant concentration visualization.
3. Capture visibility-limited effects and off-axis processes to predict effects of specific process equipment and variation.
4. Faster modeling turn-around or more parallelism for broader DOE results.
5. Revamped graphical user interface (GUI) for the Process Editor, which will enable faster process development for novice and advanced users alike.
6. Library is added with support to interface types to/from SEMulator3D, to interface with Parasitic Extraction (PEX) tools and device simulation tools such as the Gold Standard Simulation (GSS) Garand platform.
7. Makes process setup, development and maintenance simpler.
8. More configurable for broader deployment across large organizations.
9. Adaptive Incremental Re-Build in Expeditor

“SEMulator3D 5.0 can support an even wider range of processes now, which expands the usage of this platform. SEMulator3D is still the fastest, most predictive and robust semiconductor process modeling platform, and with 5.0 these advantages can be applied to even more projects,” said David Fried, CTO – Semiconductor for Coventor. “With the new features in 5.0 along with significant usability and automation improvements, we can stretch further into device-process optimization and serve the need of our equipment manufacturer customers better. This is especially important, since virtual fabrication is becoming the methodology of choice to address the time and cost issues associated with the most demanding development challenges.“

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