Lam Research's etch tech pushing 3D semiconductor memory production

Lam Research claims its Kiyo F Series conductor etch system is enabling volume production of 3D NAND flash and advanced DRAM by memory semiconductor manufacturers. Lam's technology helps in achieving tight critical dimension (CD) uniformity and control for 3D NAND and uniform etch depth for DRAM. The technology called Mixed-Mode Pulsing (MMP) is behind this achievement. "For 3D NAND, our customers face significant challenges in addressing difficult etch requirements, meeting aggressive production ramps, and achieving the cost benefits they need to make the transition from planar NAND," said Vahid Vahedi, group vice president, Etch Product Group. "We are collaborating closely with them to address these new challenges and to enable this inflection by delivering robust, timely solutions without compromising productivity." The term staircase comes into the usage once the single floor planar memory becomes multi dimensional otherwise multi-storey structure. Just like the multi-storey buildings need staircase the multi-storey memory chips also require staircase like electrical connection which need to be etched vertically. Maintaining uniformity of creating such staircases of connections without any variance in electrical properties for volume production of 3-D memory is essential. The critical part of building vertical channels is high aspect ratio (HAR) mask open. M...