Samsung innovates further in LED chip packaging to save cost and increase light

Samsung has improved its chip scale LED packages by compacting even smaller to a dimension of 1.2 mm by 1.2 mm, compared to its previous 1.4 mm by 1.4 mm measuring Chip Scale Packaging (CSP) LEDs. Samsung uses CSP to save another packaging process after the actual LED chip manufacturing. While this is saving in production of LED itself, there are other benefits by using CSP LEDs such as lower thermal resistance and high current availability, resulting in high light intensity and improved reliability. The overall impact is the final LED lamps/lights are going to be much cheaper and are of better quality when they are made using chip scale package LEDs. Samsung has manufactured its 1st generation CSP by flipping over blue LED chips and then adhering a phosphor film to each of them. They are free from metal wires and plastic molds. Samsung’s 2nd generation CSP tech ensures further compactness of form factor and offering a 10 percent improvement in light performance. Samsung says its 2nd generation CSP LED packages enable further flexibility, where company can create 2 by 2 and 3 by 3 CSP arrays and offered to customers, depending on a diversity of market needs. The availability of CSP arrays provides not only more design flexibility, but also better light quality in each LED luminaire through their one-lens design, says Samsung. Sa...