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  Date: 17/05/2015

Samsung innovates further in LED chip packaging to save cost and increase light

Samsung has improved its chip scale LED packages by compacting even smaller to a dimension of 1.2 mm by 1.2 mm, compared to its previous 1.4 mm by 1.4 mm measuring Chip Scale Packaging (CSP) LEDs.

Samsung uses CSP to save another packaging process after the actual LED chip manufacturing. While this is saving in production of LED itself, there are other benefits by using CSP LEDs such as lower thermal resistance and high current availability, resulting in high light intensity and improved reliability.

The overall impact is the final LED lamps/lights are going to be much cheaper and are of better quality when they are made using chip scale package LEDs.

Samsung has manufactured its 1st generation CSP by flipping over blue LED chips and then adhering a phosphor film to each of them. They are free from metal wires and plastic molds. Samsung’s 2nd generation CSP tech ensures further compactness of form factor and offering a 10 percent improvement in light performance.

Samsung says its 2nd generation CSP LED packages enable further flexibility, where company can create 2 by 2 and 3 by 3 CSP arrays and offered to customers, depending on a diversity of market needs. The availability of CSP arrays provides not only more design flexibility, but also better light quality in each LED luminaire through their one-lens design, says Samsung.

Samsung planning to introduce the second-generation CSP in the fourth quarter of this year, and will support a wide range of CCT (Correlated Color Temperature) specifications.

In another innovation related to LED packaging, Samsung Electronics has announces the new LM301A, a flip-chip-based mid-power LED package that can operate at anywhere from 0.2 watts to 1 watt with wide range of current options for higher light efficacy.

"Designed with advanced flip chip technology, the new LM301A overcomes what had been significant performance and power limitations of conventional mid-power lighting LED packages,” said Jacob Tarn, Executive Vice President, LED Lighting Business Team, Samsung Electronics. “We will continue to strengthen our technology leadership in the market by launching highly competitive, next generation LED products based on Samsung’s most innovative, market-proven LED technologies.”

Samsung’s new LM301A LED package offers these light efficacy alternatives:
• 170lm/W efficacy in cool white (5000K CCT, CRI80+, 85°C and 65mA)
• 160lm/W efficacy in warm white (3000K CCT, CRI80+, 85°C and 65mA)
• 155lm/W efficacy in cool white (5000K CCT, CRI80+, 85°C, and 150mA)
• 145lm/W efficacy in warm white (3000K CCT, CRI80+, 85°C and 150mA)
• 130lm/W efficacy in cool white (5000K CCT, CRI80+, 85°C, and 350mA)
• 120lm/W efficacy in warm white (3000K CCT, CRI80+, 85°C and 350mA)

LM301A package targets diverse lighting applications ranging from ambient to high intensity lighting, such as high bays and outdoor lighting. Samsung also suggests LM301A further lighting fixture manufacturers for its performance and cost-competiveness.

The LM301A uses Epoxy Mold Compound packaging for higher reliability and extended life and also protects against heat and UV rays, making it suitable for high-luminance LED applications requiring higher wattage.

The new package also will support CCT (Correlated Color Temperature) specifications ranging from 2700K to 6500K. The LM301A will be available beginning in July.

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