2.0 x 2.2 x 0.3 mm FRAM integrated MCU chips for space constraint applications
Texas Instruments has made available tiny ultra-low power MSP430 microcontroller chips with on-chip FRAM and also Flash-based in wafer-level chip scale packages (WLCSP) of size as small as 2.0 x 2.2 x 0.3 mm. These MSP430 MCUs are suggested for ultra-low power applications such as sensor hubs, digital credit cards, ingestible sensors, health and fitness products like smart watches, and consumer electronics like tablets and notebooks.
Available with 1.8V I/O on MSP430F5229 MCUs are suitable for advanced sensor fusion capabilities such as gesture recognition, motion tracking, environment sensing, and contextual awareness. The ultra-low power MSP430 MCUs are available immediately with tiny package sizes (WLCSP) starting at $1.08 USD in 1K units.