1.9 x 2 mm measuring mini MCU from Freescale for IoT applications

Kinetis KL02 from NXP is a  20-pin Chip-Scale Package MCU, the small ARM  MCU measuring 1.9 x 2.0 mm wafer-level chip-scale package, the KL02 CSP (MKL02Z32CAF4R) drastically reduces board space while retaining rich MCU feature integration. 

Features:

Multiple, flexible, low-power modes, including new compute mode that reduces dynamic power by placing peripherals in an
asynchronous stop mode
LPUART, SPI, I2C, ADC, DAC, LP timer and DMA support low power mode operation without waking up the core
Flash and SRAM
32 KB flash, 4 KB RAM
Security circuitry to prevent unauthorized access to RAM and flash contents Performance
Cortex-M0+ core, 48 MHz core frequency over full voltage and temperature range (–40 ˚C to +105 ˚C). Single-cycle fast I/O
access port facilitates bit banging and software protocol emulation, maintaining an 8-bit “look and feel”
Bit manipulation engine for improved bit handling of peripheral modules
Thumb instruction set combines high code density with 32-bit performance
Independently clocked COP guards against clock skew or code runaway for fail-safe applications
Mixed Signal
12-bit ADC with configurable resolution, sample time and conversion speed/power Integrated temperature sensor
High-speed ...