19nm JEDEC compliant eMMC 5.0 NAND flash memory modules
Toshiba has unveiled new embedded NAND flash memory modules made using 19 nm NAND Flash memory chips. These modules are fully compliant with the latest e•MMC standard and are suggested for wide range of applications such as smart phones, tablets and digital video cameras. volume production of these modules are expected to start from the end of November 2013.
Toshiba says "Demand continues to grow for large density NAND flash memory chips that can support high resolution video and deliver enhanced storage. This is particularly true in the area of embedded memories with a controller function, which minimize development requirements and ease integration into system designs. Toshiba is meeting this demand by reinforcing its line-up of high density memory products"
The 32-gigabyte (GB) embedded device features four 64Gbit (equal to 8GB) 19 nm NAND Flash memory chips with a memory controller chip in a package measuring 11.5 x 13 x 1.0mm. The JEDEC eMMC Version 5.0 compliant modules deliver read/write performance by applying the new HS400 high speed interface standard.
Toshiba said it will bring the NAND chips to a line-up of single-package embedded NAND flash memories in densities from 4GB to 128GB. All will integrate a controller to manage basic control functions for NAND applications.