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2x20W power capable digital audio SoC from ST in 2.57x3.24mm CSP package

Date: 11/07/2013
STMicroelectronics has made available audio IC measuring 2.57mm x 3.24mm delivering up to 2x20W of audio output power. ST says STA333IS is the most power dense single-chip digital audio system available today. STA333IS features digital audio IP such as ST’s proprietary FFX full flexible amplification.

ST says the STA333IS is unique in the marketplace, since only ST has the technologies and audio IP (Intellectual Property) to combine advanced signal processing and power circuitry on a single chip. With its wide operating voltage range, from 4.5V to 18V, it is ideal for battery-operated equipment as well as space-constrained products such as LCD or LED televisions, docking stations and digital wireless speaker systems, suggests ST.

STA333IS is designed to produce high-level of audio quality with the chip not heating up much and also not producing much of electromagnetic emissions.
Also available, the STA333SML variant for “micro-less” applications operates without an external microcontroller, enabling designers to create digital amplifiers with the lowest cost of ownership.

Samples and production quantities of the STA333IS and STA333SML are available now as 5x6-bump 0.5mm-pitch Chip-Scale Package (CSP) devices, priced from $1.00 for orders over 1,000 pieces.
For further information go to http://www.st.com/sta333is