Latest software for virtual chip-fab supporting 3D, Trigate and HKMG

Coventor has made available of its SEMulator3D 2013 software platform for virtual IC semiconductor chip fabrication application to the broader semiconductor ecosystem. SEMulator3D 2013 designed to solve complexities of integrated 3D front-end-of-line (FEOL) manufacturing processes such as Tri-Gate and High-k/Metal Gate logic, and advanced 3D memory technologies. This tool helps Fabless chip companies in migrating their intellectual property (IP) into the new semiconductor manufacturing technologies. “With new silicon architectures ramping quickly, IBM is introducing new manufacturing technologies that will keep us on the cutting edge of chip-making for server microprocessors, systems-on-chips and specialty silicon for consumer applications,” said Gary Patton, Vice President, IBM Semiconductor Research & Development Center. “Tools such as Coventor’s SEMulator3D Virtual Fabrication platform have allowed us to speed our end-to-end technology development in 22nm and beyond, enabling a faster time to market for our customers who depend on IBM innovation to create the latest servers, smart phones, GPS systems, routers and other devices.” Coventor explains: At the core of the new SEMulator3D 2013 platform is a revolutionary physics-driven modeling paradigm for addressing physical process behavior that makes virtual fabrication more predictive and provides new opportunities...