1.2x 1.0 mm footprint crystal oscillator due to new material from Tanaka

Tanaka Precious Metals has announced it will commence the provision of samples of gold-tin alloy bonding material (AuSn alloy lid) which is able to seal ultra-compact crystal oscillators with a mounting area of 1.2 mm x 1.0 mm at half the material cost of conventional products from March 22. This AuSn alloy lid is a component to manufacture the so-called 1210-size crystal oscillators with a mounting area of 1.2 mm x 1.0 mm. The conventional 1210-size AuSn alloy lid Tanaka Kikinzoku Kogyo has provided as a prototype had a washer frame width of 0.15 mm and thickness of 0.015 mm. By combining high-precision press technology and precise rolling technology, the new product is able to provide the same air tightness and bond ability as the conventional product with a frame width of 0.10 mm and thickness of 0.010 mm. With the general composition of AuSn21.5 (78.5% Au, 21.5% Sn), it is possible to reduce material cost by approximately 53% compared to conventional products. With the development of high-density mounting of electronics, sealing methods using AuSn alloy are now widely used Lid is a component for vacuum sealing crystal oscillators used to control the electronic signals in mobile phones, smartphones, PCs and car-mounted devices. The miniaturization demand of the devices is required which associated with high-density mounting of electronic equipment has accelerated in...