Date: 7th Jun 2011
NXP offers plastic packaged RF power transistors
with cost advantage
NXP Semiconductors N.V. has announced the launch of a
complete line of overmolded plastic (OMP) RF power devices
with peak powers ranging from 2.5 to 200 Watts. The new
range of OMP devices will be introduced as a complement
to NXP's extensive range of products in ceramic packages,
providing customers a choice for more cost-sensitive applications,
while maintaining the required level of RF performance.
NXP's OMP roadmap covers all the high-volume frequency
ranges and applications: 10 - 500-MHz ISM, 470 860-MHz broadcast,
700 - 2200-MHz GSM, WCDMA telecom, 2300 - 2700-MHz LTE telecom,
2.45 GHz ISM, and even products for the 2700 - 3500-MHz
S-band. Product types will extend to all existing categories:
discrete pre-drivers (2.5 - 10 W), drivers (20 - 45 W),
MMICs (20 - 60 W), finals (50 - 200 W) and integrated Doherty
devices (50 - 110 W).
OMP products up to 10 W will utilize NXP's existing IC
packages, with new footprint packages developed for higher
powers. For customers using full surface mount assembly,
gull-wing versions will be available in addition to traditional
straight-lead versions. A limited selection of devices is
available now as engineering samples, with volume production
scheduled to start in Q4 2011.
Product Features:
Product solutions from DC to 3500 MHz
Single-stage broadband drivers in HVSON, from 2.5 to 10W
Single-stage drivers from 25 to 45 W
Dual-stage MMICs from 20 to 60 W which can be used as high-gain
drivers or combined as low power dual-stage Doherty amplifiers
Fully integrated plug-and-play Doherty PAs in a single package
(50 to 110 W)
SOT502-sized, single-ended and push-pull final transistors
ranging from 50 to 200 W
"Compared to ceramic, overmolded plastic can significantly
reduce the overall BOM cost by 20 percent, offering customers
a clear choice in cost versus performance. As a complement
to our existing product portfolio, the new OMP RF power
devices give design engineers added flexibility and demonstrate
our ongoing commitment to RF power," said Mark Murphy,
director of RF power products, NXP Semiconductors.
|