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Date: 1st Jun 2011

1G to 10G scalable EPON IC from Broadcom

Broadcom Corporation has unveiled a new EPON chip BCM53600 targeting growing broadband market.

BCM53600 is a 1G to 10G scalable, and single chip PON MDU SoC. Broadcom boasts the BCM53600 series deliver unparalleled system integration, allowing carriers to quickly deploy pizza-box applications with the fewest possible components, dramatically reducing system cost and power consumption. The complete SoC includes an integrated switch, PHY, CPU, EPON MAC, voice DSP, and software development kit (SDK).

The rich feature set including TR-101, TR-156, and CTC2.1 specification compliance delivers end-to-end quality of service (QoS), classification, filtering, and security. The BCM53600 series offers multiple interfaces and applications such as VDSL, VoIP, 10G-EPON and GPON.

Additional features as per Broadcom include:
Proven interoperability for EPON deployment with leading carriers.
Integrated SDK compatible with entire Broadcom switch family for shorter product development cycle and faster time-to-market.
Feature-rich VoIP DSP for easy deployment of high-density voice applications.
End-to-end QoS and security for SLA guarantees and prevention of denial of service (DoS) attacks.
Supports IEEE 802.3ah 1G EPON standard.
New 1G EPON MDU series includes four devices: BCM53602: 8-port FE SoC, BCM53603: 16-port FE SoC, BCM53604: 24-port FE SoC and the BCM53606: 24-port S3MII SoC.


Jeff Heynen, Directing Analyst, Broadband and Video at Infonetics said, "EPON revenue in China continues to increase, with fiber deployments continuing at a rapid pace. There appears to be no sign of a slowdown in the already overheated EPON market, especially with the Chinese government planning to spend another $42 billion to expand and improve China's broadband infrastructure."

Greg Caltabiano, Senior Director & General Manager, Ethernet Access, Broadcom Corporation said,
"Carriers are under increasing pressure to increase revenue while reducing costs. Our proven high-performance, fully integrated SoC enables carriers to deliver value-added services to subscribers while dramatically reducing costs and maintaining compatibility across our entire family of EPON and Ethernet products."

Broadcom will demonstrate the new series at the 2011 Computex conference and exposition in Taipei May 31 - June 4.
Devices are sampling now with volume production slated for the fourth quarter of 2011.


 
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