HD display driver IC from Orise made using TSMC's 80nm HV process

Orise Technology has introduced the fully integrated smart phone high definition (HD) display driver IC. The new display driver is manufactured on TSMC's 80nm High Voltage process technology.

The Orise HD720 high definition display driver features TSMC's groundbreaking SRAM block that provides higher resolution and a higher speed interface capability than previously achieved using previous generations of SRAM for WVGA resolution.

Key to Orise's breakthrough was manufacturing the HD720 display driver IC on TSMC's 80nm High Voltage process technology. The process is the foundry segment's leading technology to provide copper wire interconnects in High Voltage technology. It achieves a higher SRAM density with 20% more speed than previous generations to enable HD display quality SoCs with the lowest power consumption. The 80nm High Voltage process technology is manufactured on 12-inch wafers in TSMC's GIGAFABs.

TSMC also provides customers with a 0.11-micron High Voltage process for the volume production of WVGA/ qHD display drivers, widely used in present-generation smart phones.

"The ability to bring the high definition experience to the next generation of smart phones is a huge step forward," said Dar Chang Juang, Orise President. "With smart phone shipments expected to increase 23 percent this year, the HD720 will provide a valued feature."

"Orise has successfully leveraged the leading edge advantages of the 80nm High Voltage process technology. Their success is another example of how TSMC's 'More-Than-Moore' trusted technology leadership is helping our customers to maximize the value of their innovation," said Jason Chen, TSMC Senior Vice President of World Wide Sales and Marketing.