|
Date: 20th Jan 09
Low cost single chip
GSM mobile phone IC
The new X-GOLD110 single chip GSM phone IC announced by
Infineon is set to reduce the Bill of Materials (BOM) cost
for low cost mobile phone manufacturers in emerging markets
such as India and China.
The X-GOLD110 is central core part of Infineon's mobile
phone platform XMM1100. The new platform supports color
display, mp3 playback, FM Radio, and USB charging. The chip
is also ready for dual-SIM and camera solutions. Due to
low count of semiconductor and other components used, the
PCB design can be managed in four layers.
The ready solution XMM1100 will enable mobile phone vendors
to complete the design in 3 to 4 months due to the almost
ready solution offered by this platform.
However the samples are only available in Q2, 2009 and
volumes much later in second half of year 2009.
|
